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[已解决] 请问有谁能说说铁佛龙是怎样焊接的??

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发表于 2007-10-19 15:29:02 | 显示全部楼层 |阅读模式 来自: 中国陕西西安

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我们做线路板设备的,有时用到铁佛龙这个材料,不过由于焊接技术的不成熟,使用时有很大的局限性,在三维上看能不能找到一些好的解决方法!
发表于 2007-10-19 20:56:17 | 显示全部楼层 来自: 中国辽宁沈阳
聚四氟乙烯在熔点以上(380℃)其黏度仍有1010~1011Pa·s,即使加高温度也只会分解而不流动,因此对聚四氟乙烯材料的焊接区别于其他热塑性塑料。聚四氟乙烯的焊接有热压焊和热风焊两种,热压焊接是将焊接的两片PTFE材料加热至高于熔点,在不太大的压力下,将两片材料压合在一起。热风焊接是用与聚四氟乙烯性能相仿的熔融加工的氟塑料如四氟乙烯-全氟烷基能乙烯基醚共聚物(PFA)作焊条,用热空气将焊条与待焊的聚四氟乙烯同时加热、加压,使聚四氟乙烯材料通过焊条连接在一起。

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发表于 2007-11-16 18:40:38 | 显示全部楼层 来自: 英国
? 基本不能焊...2楼说的只针对膜...厚点就不行了..2 Z4 J' R3 Y2 @% C
能具体说说电路板哪边要用PTFE? 如果是加工PTFE电路板..怎么会需要焊接的?
发表于 2007-11-16 20:09:05 | 显示全部楼层 来自: 英国
查了下..还是可以焊的..把资料给你..
8 f; Y" s3 ~, V; Y. B6 v# D9 b16.4 Welding and Joining
& O5 H5 v! @+ ~/ E) aThe bonding techniques involving adhesives are
, n, M  Q- y/ ?( [/ Xnormally suitable for applications where the fluoropolymer
: D1 H6 |$ U5 P0 Z* F) @does not carry large loads such as those
/ \* g. ?6 f8 Y/ I: Iexperienced by chemical processing equipment.
! _/ m7 A- g- iWelding or adhesiveless joining is a method by which# J/ `+ x- i' ^, C. V2 ?& K
parts for load-bearing applications are manufactured.6 ]- T. s+ {' ^% A" b* L
The load could consist of temperature, chemical corrosion,  P: |9 _3 @" \. ]
and force. This method also known as welding4 A3 |. r5 E! ~
or joining allows economical fabrication of complex
/ V2 r* Z" A  ~# @6 \$ l. j2 gparts by joining individual components.8 O$ s: a5 V: o
It is possible to obtain a good bond between fluoropolymers
3 X% K0 N0 j: r5 j% q& xthemselves, without the use of adhesives,
1 u! }: Z8 }# x- @6 C2 F" Jby application of heat and pressure. Pressure can help$ \2 `; X, S* Z6 C
drive the molten polymer into the pores of the substrate.
$ L, ^8 K9 a% gBond strength is dependent on the mechanical
3 @' b! m* t2 P  [. \4 ]7 }% k- xinterlocking that is achieved by the adhesion mechanism,% ]8 ^3 q7 M, ^! J& F7 s& H
improving with increased surface roughness of
% S5 O8 q& U4 j0 d/ h2 uthe substrate. Examples of parts made by this technology$ {) w5 o( m! u# k  L
include glass cloth-backed polytetrafluoroethylene: y% K  I; `) A0 q  {$ X+ a0 N. Z
sheet, or multi-ply circuit board and coated; F) i5 z, P: v
aluminum or copper sheet. Achieving this type of
* v9 c. |+ m) \/ _/ q; C7 lbonding is more complex with polytetrafluoroethylene% i/ `) E  d* ?9 d
than melt processible polymers. PTFE does not flow2 X7 f+ a, q6 W" k
after melting due to its extremely high viscosity.
9 ]6 J0 u% z) M- xIt is possible to achieve adhesiveless bonding using: e& M( ^3 ?' X- M, o) M
standard PTFE in special applications where the
, K% b5 I" @2 ?: ^  q3 Jpolymer can be heated to a temperature well above its, k1 V1 F( o1 s
melting point. It can then be forced under pressure* p( r/ ]0 _$ ?  [; j& ?4 M" G' s
into the substrate surface. These polymers are not  I. [3 R; z9 O8 G0 R
suitable for applications where the geometry of the
# f  @" B3 W$ r7 Z/ tjoining objects must be preserved, contact surfaces9 f7 C: h% g+ P
are smooth, or the objects being bonded are too large.1 P5 Z5 e1 ~4 T
In such cases, a different type of polytetrafluoroethylene' I# o( S. n2 B) Y7 ~
is required.
4 u3 w# q# l: ^) f8 \8 APolytetrafluoroethylene for these applications is+ \5 _9 @+ U' v6 T1 y" z. J; z
known as “modified” which refers to the presence of8 J# s! K+ I: O, W4 U
a small amount of a second perfluorinated monomer,
1 o# F; \2 Q( o- S) Y7 Z; L+ @9 J* rknown as a modifier, in its structure. The modifier# A. G' d/ z" r7 G# {2 S6 H
molecule always contains a pendent group. The* L- Y% x5 Z3 J# L% j6 n9 v4 M
preparation method of this type of PTFE has been described- f* ?7 I# ]6 w, u  q
in Ch. 5. Its commercial grades have been
- l3 W1 Z6 ~! k! _) ^! _described in Ch. 6.3 s$ T$ {5 c, W% g5 A& Z
How does it work? A simple explanation is offered& O8 l" q5 E- s3 t0 ^8 E
here, based on the author’s own experience. The
  E* L* [- o, j8 s) @6 ~0 rmodification reduces the molecular weight of the polymer,
* f. l& o2 K8 C4 ?. T: ?) Zwhich in turn reduces its melt viscosity. Lower
6 F$ N2 [( B' Q1 ]  i) Nmelt viscosity increases the mobility of the polytetrafluoroethylene3 a& J  T3 v/ Y, |1 y
chains. This facilitates diffusion and# t, F6 i* H$ m  ?! A, E" k7 ^- B+ e
entanglement of polymer chains at the bonding interface.
  x! J9 n. K- ?1 \" g( V6 NThe pendent group of the modifier disrupts the* i% x% F: N; R
crystals of PTFE, thus preventing excessive crystallization.
! u9 h" V+ v/ J9 x$ [Crystallinity which is too high results in poor
* Q! n  t) w0 C% h0 Rmechanical properties such as poor tensile and flex
2 t  u6 L9 B2 Z+ t0 eproperties. An optimally modified PTFE has good
8 o, E7 _9 N* ?; S2 H5 e. {/ Lmechanical properties in addition to weldability.: ^$ I7 h) q: R" f
Welding can be achieved using PTFE made by
8 i! B7 Z: S8 Rdispersion or suspension polymerization. Most applications
& @$ M6 g/ o6 ~involve welding of parts made from granular
, {" b2 |$ f) X3 M5 a0 Tresins (suspension polymer). Dispersion polymerized
. u0 R0 @9 i* H" `PTFE is also used for application such as wire
8 e* g7 U8 Y; t7 y; r/ c, Tcoating. A thin (50–100 μm) tape of the “modified”' a2 [& g' m4 Z* N6 p, r& R
polytetrafluoroethylene is wrapped around the conductor
) n9 {( T+ K8 k8 h9 W2 @# m, Gfollowed by sintering. The layers of the tape( J4 U/ ~1 J8 Q# }  n( Q
adhere to each other and form a solid insulation, due
$ V% O$ n6 [1 r  O3 ~% Bto its good interlayer adhesion, around the conductor$ n( H4 J. l0 z6 o" R0 V$ x
at the completion of sintering cycle.
1 h. t  [# D- q& @' q5 W3 E5 u2 q& R' R16.4.1 Welding Technique- d0 W. _/ \9 {% E  c1 _
Quality of a welded area is defined by the strength
- B; f+ {; e0 M" N. t( C9 N& [4 X: @of the bond. One of the ways to measure bond strength0 @& v$ P1 [9 g3 g0 L/ \, k, u
is to cut a microtensile bar specimen in such a way' y: m' j; U$ g: Z8 r
that the weld line would fall near its center (Fig. 16.5).+ c! E0 T/ e4 g& ~
Tensile strength and elongation can be determined by- q$ S- _1 g2 d. H5 x4 n4 a: {
extensiometry. Weld factor is defined by Eq. 16.1 as  s8 r% C. f6 z* K6 H7 u
the ratio of tensile strength of the welded specimen: }+ P5 E, E7 Z; d7 f: X* y. P
(Tw) to the tensile strength of the material (Tp). The
& p3 V4 Y' r  j  `weld factor is defined for the weakest polymer, if two
8 b) A0 n- A: {9 x4 H. V, jdifferent polymers are welded together.' T8 X- f7 ^# q( e0 k+ U
Three variables are significant in welding a given' P1 l7 G2 N& X$ d: L/ d5 Y- Y6 e7 f
modified PTFE part: welding temperature, pressure
4 Q4 i. T9 E0 F: eand time. Optimal combinations of these three pa
7 p) ]( F0 D5 P" M2 yrameters must be found for successful welding of parts.
" X: g; _9 ^2 [! ?* f2 P+ uTemperature should be well above the melting point
! t! T8 ?5 K' M4 f+ w: \  ^(320–330°C), typically in the range of 360–380°C., p& ^; @$ O. w6 p+ E, K: B
Little pressure is required to weld the parts after reaching
/ w2 q6 H# K. Z& s' Ggel state. Less than 350 kPa, and often less than
) M* F' `6 {2 L. x( p, O35 kPa, pressure is required for welding. It is normally4 _+ C1 Z3 p1 s3 R2 k* p! |* h4 l' c
not possible to trade higher welding pressure
1 T- `% ]2 P* ~! Q7 k& c1 yfor lower temperature and vice versa. Time, the third
% V$ t$ A8 W- Y/ c7 t& P$ H( U6 dvariable of the process, is dependent on the size and. t6 A/ B! k. ^/ R2 Q4 r4 W$ A
shape of the part. The actual weld time, defined as, U8 }  v8 y* K, R2 R' B9 u
time at the final temperature, is of the order of 1–2) O, Z5 ]/ v% a' b+ G' E
minutes. It often takes a great deal longer to heat up6 ]. d# y0 j9 X- h: P4 a
the part to the welding temperature. High heating rates
% J7 k) _2 ?0 I# t' r, rdo not accelerate the process due to the low thermal5 G7 [& f/ S; x7 r
conductivity of PTFE. Heat rates similar to those of
. z% w& J" b2 E/ j4 d' D7 g- `sintering cycles of preforms can be expected.! }  y5 Y3 V( Y$ Q5 c2 ?; g; Y1 D
The mating surfaces should be smooth and uniform7 z9 m" |0 p8 k9 n. G7 ~
and free from any contamination. Unsintered
/ d! X2 ~3 i( ]$ R8 r% w$ fpreforms and sintered parts of modified polytetrafluoroethylene
4 \6 g* J& `+ Ocan be welded. Sintering and welding can1 j  Q" g7 ?. f% Z# s5 X
be combined. Parts can often be stacked up in the. j6 R2 v8 e; ]& [% Q9 ^
sintering oven without additional pressure. A weld
* Y( n2 o! t) M. [( Jfactor of one can be routinely obtained in the combined
. @. y- i% Q8 R/ ~* {+ U! d, [process. A higher pressure is required for welding  V+ V7 ^* ?; [1 f) P
sintered parts to counteract the residual stresses,/ c  b2 w& v1 d: g8 h6 f
which tend to move the parts upon release. It is important
2 o8 h- ]$ {' lto cool the welded parts slowly to minimize+ Z* {8 |& F5 z
stresses stored in the part. Figure 16.6 illustrates a
+ N8 q& r" u2 d" udevice for hot-tool welding films and sheets.6 U( C- z/ D# ^8 f% m" {; y* o
Figure 16.7 shows a comparison of the stressstrain
* ?; D4 R' m- \1 scurves of a conventional and a modified PTFE
9 i  c- J" k9 _4 o8 }4 s; c7 J+ ifor the original and welded material. The weld line in. M: Z" H6 O& k6 p% J; [* z# h# r! j
conventional PTFE when welded to itself, at best, fails8 l8 x& J' @* l# u
at very low strains. In the case of modified resin9 n: s, x' i% l' A" @8 g
welded to itself, the weld factor attains value of 0.80–
# u! j. c5 Y& s0.85. Weld factors for welding of conventional and- Q6 M) M6 ~- D* N+ `, W
modified PTFE have been reported in the range of
  X3 e8 U# [! B# n: W$ e6 a0.66–0.87.[13]
# C2 a, g2 Q. D; o- z" ~: h/ iAnother method is welding with the help of a PFA
3 @: _& @( J& m8 y8 w(melt processable) rod. In this case, the conventional
3 \/ H9 ^( N0 [. u( {% ^& _' wor modified PTFE is heated by hot air near the seam
7 s3 _4 \/ z( Q  B& Tuntil it is in gel state. The PFA rod is molten and used& x+ Y: G% K$ V
to fill the seam.
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