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Radiation Technology for Polymers
% v) @% o4 n( }" y* l
: R) R! g1 i* r# ` t5 c2 gby Jiri G. Drobny+ m3 @) j# i6 g6 z) L2 o
Publisher: CRC; 1 edition (November 25, 2002) : X. |- ~* k2 o, T0 |
Language: English
) N( p2 u: E+ T) i! `6 TISBN-10: 1587161087 , N, `: l) }8 a- [1 T: o/ ~! S
ISBN-13: 978-1587161087
& ]' m% @) l+ i/ ~6 i, X' H, L* M2 I8 A7 q2 \
Book Description
& ]/ d5 d1 c. |& N0 XThe industrial use of ultraviolet (UV) and electron beam (EB) radiation is growing rapidly and now penetrates an ever-widening range of applications, including electronics, printing, packaging. Resources and references for seasoned professionals abound, but few effectively introduce the field to newcomers or provide fast access to specifics on UV and EB effects on particular materials. This book does both. Radiation Technology for Polymers systematically presents the practical aspects of using UV and EB radiation to treat polymeric materials. Drawing on more than 30 years of engineering experience in polymer processing, the author describes the production and properties of UV and EB energy, explores processes associated with both types of radiation, and provides a detailed overview of their applications. He concludes with a look at recent developments and emerging trends in equipment, chemistry, and technologies. Whether you are an engineer or scientist new to radiation technology or a product or process designer researching the effects of radiation on a specific material, Radiation Technology for Polymers is the place begin your search for information. It offers a complete overview of the technology and provides valuable direction to sources of more specific, detailed data.
7 a+ e; L( @% y* K3 G5 N+ G# | Z3 M" ?8 b! n* u6 q* X# R8 Z8 L- @
Book Info6 g9 u, y1 e# i0 Z2 L' _" i
Covers the processing of thermoplastics and elastomers in film, sheets and other forms as well as coatings, paints, inks, and adhesives. Presents detailed reaction schemes in a simplified manner. Offers a complete overview of the technology of radiation processing.
$ U( G5 j; P8 }' v: _( A6 n+ Q B: q, s& N9 A4 G- t: T
e7 @* ^4 N8 x* g+ [& m
Contents; ]6 b! w. K+ e
Chapter 1 Introduction
# `( u/ s! g6 m9 Y# ?: W& e- c8 ~1.1 Basic Concepts
1 A* m4 c9 ^: _# ~9 h0 ZReferences* k3 e! x2 x+ X7 Z
Chapter 2 Producing UV and EB Energy
$ G9 i9 \( X: {" A' h1 k2.1 UV Energy and its Properties/ Y8 f0 q9 n% \$ [# ?
2.1.1 Light Emission from Mercury Gas Discharge4 `- R6 q* K! R# E
2.1.2 Light Emission from a Microwave Excited Discharge, Z8 h+ o5 Z7 q9 a* m' m
2.1.3 Generation of Monochromatic UV Radiation) \4 P, p+ M2 E
2.2 Electron Beam Energy and Its Properties3 e! ?: F. H! |/ S7 w5 b) ~
References
/ Y V* S9 G7 vChapter 3 Ultraviolet and Electron Beam Curing Equipment: A) }! k w$ `9 d/ F* e, v
3.1 UV Curing Equipment
# Q2 Q7 U& Z2 `3.1.1 Lamps/ I7 B# G$ [: d2 f6 G+ w; T
3.1.1.1 Medium-Pressure Arc Lamps
: B( ~" q( d6 K! }2 D3.1.1.2 Electrodeless Lamps, `8 n$ P$ Q" j& B7 u
3.1.1.3 Low-Pressure Mercury Lamps
! }; T/ c6 t. g2 R5 u {3.1.1.4 High-Pressure Mercury Lamps
- e9 O4 I: I3 k/ @3.1.1.5 Excimer Lamps$ R) k S( D# I( f& |
3.1.1.6 Xenon Lamps
1 f& R8 b0 _/ C9 a3.1.2 Lamp Housing9 a& f4 H" A6 p6 f) v9 _9 p- M
3.1.3 Power Supply and Control Systems3 `" R: U0 y# K" L. l3 Z& h
3.1.3.1 Power Supply Systems; A+ X1 S6 J2 Y8 ~2 x, f7 B- i* H
3.1.3.2 Control Systems
! Q1 [0 S6 L7 b: F+ w0 k) b) d3.2 Electron Beam Curing Equipment$ o7 B& ]/ g$ P, P
3.2.1 Particle Accelerators: k) K) W: M0 u
3.2.1.1 Direct Accelerators
) e/ x; ~# D0 u# a2 {: _2 m7 N+ K3.2.1.2 Indirect Accelerators
" K3 Z+ o9 d2 U" K; s2 o3.2.1.3 Low-Energy Electron Accelerators
' q( H" ]; A0 k5 u M3.2.2 Recent Trends in Development of Electron Beam Curing9 d7 `+ F q9 c& c! k8 c! e
Equipment and Technology/ [# u, w8 \- m
References
9 x( L" h R3 d( Y& m, O4 {: u& e4 c
% p2 v% r- f5 O! F# g; \& [$ u0 EChapter 4 Ultraviolet Radiation Processes
# ^% u( f7 [' }4.1 Basic Concepts U7 `2 ?, d' h+ v- x9 V% X/ e
4.2 Photoinitiators and Photosensitizers X- T4 T: L2 ^3 Z3 ~
4.2.1 Free Radical Photonitiators0 \5 G) }) W: Y, ~' F
4.2.1.1 Type I Photoinitiators" m/ _/ Z6 p5 w1 j2 H
4.2.1.2 Type II Photoinitiators. e. o4 u/ j$ v% G+ s6 a# s/ ?
4.2.2 Cationic Photoinitiators+ n9 }5 y* r' F; {
4.2.3 Anionic Photoinitiators u' [' ~- h3 M/ F9 i8 |
4.2.4 Oxygen Inhibition of Cure
% m7 \2 B) P! N% m) t; ~4.2.5 Initiation of UV Hybrid Curing
# w; s. n4 J2 y4 s( s4.3 Kinetics of Photoinitiated Reactions! |$ {1 d) ?, _& g
4.3.1 Kinetics of Free Radical Photopolymerization0 }3 i2 V+ |6 O. [- f3 h
4.3.2 Kinetics of Cationic Photopolymerization
* e. B- U3 @# o4.4 Chemical Systems in UV Processing
: }- n5 o* b9 D4.4.1 Free Radical-Initiated Systems7 d) \2 j& ]" F5 x) T! o
4.4.1.1 Acrylate/Methacrylate Systems
7 @! o( `4 [7 h1 G* }! Q( m5 T4.4.1.2 Styrene/Unsaturated Polyesters. D) U( r4 c U2 U7 c K
4.4.1.3 Vinyl Ether/Unsaturated Esters
2 a6 Q! j$ r0 `4 @0 g4.4.1.4 Thiol-ene Systems
* c* s* q3 l9 b4.4.1.5 Donor-Acceptor Complexes
4 Z8 a, ~* b8 D5 Y5 h3 v9 Z/ D4.4.2 Cationic Systems
0 A4 \% m! H, Y4.5 Photocross-linking of Polymers$ U- e5 L2 i" A7 Z/ j- x6 Q
References* n' Z2 C. |1 C. f% L% y8 ~ Y
Chapter 5 Electron Beam Processes
- \) Q5 L! [$ _! t5.1 Radiation Cross-link Promoters
) q) P! }7 V3 G5.1.1 Indirect Cross-link Promoters
1 {/ J- p1 R0 N( w& _; B* d5.1.1.1 Halogenated Compounds
: j) a$ j1 S: m0 g' \5.1.1.2 Nitrous Oxide
1 l" z* G7 g: C) o' y5.1.1.3 Sulfur Monochloride+ R: \. ~* K! o5 G, I5 a
5.1.1.4 Bases
8 |2 n9 Z4 Q- b& F( @: l$ h5.1.2 Direct Cross-link Promoters
6 V$ S& Z6 A9 k' D2 u% w/ n5.1.2.1 Maleimides2 i2 n- y1 b+ k; I
5.1.2.2 Thiols (Polymercaptans): I1 O2 w; D1 L& @3 T( @- l0 y
5.1.2.3 Acrylic and Allylic Compounds.
! {& n# \% L, T1 k5.2 Retardants of Radiation Cross-Linking
3 Y& c0 @, {* S. }5.3 Electron Beam Processing of Plastics
- W# b2 b8 Y0 {9 }9 x4 k# w; o$ c5.3.1 Polyolefins) H2 b/ _5 T) v' M
5.3.1.1 Polyethylene
0 _* H7 x) r3 }9 l8 @5.3.1.2 Polypropylene; {9 `, {' J9 S* S- ?
5.3.2 Polystyrene0 j% U& Z( l. y( l: A
5.3.3 Polyvinyl Chloride75+ `3 c2 L$ T5 I$ O! l" i& t# y
5.3.4 Polymethacrylates and Polyacrylates753 o! T. t3 ~; \2 `" D% x
5.3.5 Polyamides( I" {4 h/ U; x0 q3 B$ _5 R. F+ K
5.3.6 Polyesters# v; B9 M) S* p% @5 D7 {9 \4 g
5.3.7 Fluoroplastics
; e' [$ }" C5 R5.3.7.1 Polytetrafluoroethylene
1 s! M, K5 R( x6 F( @/ o/ W5.3.7.2 FEP3 @4 H. b* p) ]/ J: i y$ o
5.3.7.3 Other Fluoroplastics
4 o0 @8 C) P* B1 h4 S6 M5.4 Electron Beam Processing of Elastomers( H& Q6 y! W7 p. U
5.4.1 Physical Properties of Radiation Cross-linked Elastomers* e2 n! g$ P; c
5.4.2 Effects of Radiation on Individual Elastomers8 X5 u& B0 w. {8 V: v2 {2 j; ]7 P
5.4.2.1 Natural Rubber and Synthetic Polyisoprene
+ |: `5 e5 X/ Y0 K" l2 z5.4.2.2 Polybutadiene and Its Copolymers
6 R6 }2 I2 u3 m7 S! r5.4.2.3 Polyisobutylene and Its Copolymers+ U; `# \, s9 U3 u" O
5.4.2.4 Ethylene-Propylene Copolymers and Terpolymers& y6 m, @5 o; J6 z
5.4.2.5 Polychloroprene* @0 S0 Q3 J& t2 n
5.4.2.6 Silicone Elastomers
, a- ^, B! h( y5 @, S( `( t8 F5.4.2.7 Fluorocarbon Elastomers! U# L5 S0 X; F
5.4.2.8 Fluorosilicone Elastomers$ `, h, ]! O3 S
5.5 Electron Beam Processing of Liquid Systems
2 w+ X" z0 [2 S1 i# l: g) v5.6 Grafting and Other Polymer Modifications8 `! V" P$ R; Y2 \ C/ F
5.6.1 Grafting) A, t5 O; |/ c* P8 g. M j( u
5.6.2 Other Polymer Modifications% g) k! Q- ?/ `" ]
References4 |& o4 t3 W* h, @# q
Chapter 6 Coating Methods Used in UV and EB Technology
( ?& w, \# t7 ~( {2 @6 s; S6.1 Roll Coating
6 y* k: ^0 B( G3 b5 M- t' Z6.1.1 Direct Roll Coating
% O- @/ R, r/ K3 P. |( P6.1.2 Reverse Roll Coating' v) R6 w0 |. B1 X* Z- s; A
6.2 Curtain Coating
4 Y" n, b+ g) o2 H; B. C6.3 Spray Application
, k! i( k2 N# k( z1 C$ B- `: E8 w6.3.1 Compressed Air Gun Spraying
+ ^3 U. s$ D( Y6.3.2 Airless Gun Spraying
9 Y4 U# F! E- M6.4 Dip Coating( F3 B9 [0 X7 C% @& g. H5 K
6.5 Flow Coating
9 }; I5 A0 n( ^# }. W6.6 Spin Coating
/ ?1 w3 ^7 a/ I9 ?& L0 ]6.7 Rod Coating
& T% b- y2 \7 ?, i5 {& i6 v6 UReferences* n/ x8 F( s) \) P- a
Chapter 7 Applications of UV Radiation( G' }. c, k0 E3 q7 O7 D
7.1 UV Curing of Coatings and Paints' f5 N( R2 \$ {- k+ H
7.1.1 Functional and Decorative Coatings" V9 i: u4 f$ h& j" X b' m f: @
7.1.1.1 Coatings on Flat, Rigid Substrates
1 q0 r# J$ F' Z5 |# N% r2 E7.1.1.2 UV Curing of Coatings on Flexible Substrates
4 i; F. Z, j8 _) p, u7.1.2 UV Curing of Lacquers, Varnishes and Paints
! ^5 |; B! V: y4 C2 _7.1.3 Three-Dimensional Curing8 T8 r! H$ J- f4 E" a# N$ H# l
7.1.4 UV Curing of Coatings and Inks on Cylindrical Parts
; N% b9 C2 N$ @7.1.5 UV Matting of Coatings
" E l7 f8 c7 _7.2 UV Curing of Adhesives
( o! T+ X6 o& E; H3 U* k0 o! E7.3 UV-Cured Silicone Release Coatings
; c& a6 B2 d8 F: }7.4 Spot Curing6 s. t% S) _8 r/ K! S/ m: [1 |6 z* p$ _1 v
7.5 UV Curing in Printing and Graphic Arts4 \( M( i: f6 r
7.5.1 Screen Printing; N+ x* q N/ ?, E# x b' a
7.5.2 Flexography
) l- \$ b! f; f" v7.5.3 Letterpress and Offset Letterpress (Dry Offset)
8 Z/ s; q6 ^" N# M( S6 d" R: ^7.5.4 Lithography
9 Q4 [. i' h$ c7.5.5 Rotogravure Printing6 H$ Y9 b( t; Y$ H \
7.6 Rapid Prototyping
: [3 S5 w/ v( H( d! h9 |7.7 UV Powder Coatings
) A9 C. O0 {8 J$ e4 y7.7.1 The Chemistry of UV-Curable Powders& y1 [5 W0 B5 m2 {' ~
7.7.2 Material and Substrate Preparation
: D& A0 {- d; y) M+ E7.7.3 Powder Coating Application5 c3 I7 ]( \$ b" D5 L1 R
7.7.4 Substrates Suitable for UV Powder Coating/ J4 J8 D# H- c Z+ r4 x( x% @
7.7.4.1 Plastics
) v1 }# P$ m3 i7.7.4.2 Wood and Wood Composites
5 W" n o% |8 t* _) F, V7.7.4.3 Preassembled Parts% m% q' `6 E9 O
7.7.4.4 Large-Mass Parts2 a, P9 f6 p& d
7.7.5 Applications
2 V" k* X. T# X/ \! f' u7.8 Other Applications for UV Curing w w$ s0 o, |* g: [5 I4 [% S
7.8.1 Electronics
, J2 X& D! w2 S2 b# E7 F, J" x7.8.2 Optical Components and Optoelectronic Applications6 e/ d3 U' v @/ ?6 L
7.8.2.1 Optical Fibers; J0 _4 c# t$ j9 S( ]& F
7.8.2.2 Other Optical and Optoelectronic Applications
; ~0 ^8 d: s. _" W2 k3 x7.9 Production of Composites
: K, H/ p/ E a: W7.9.1 Dental Applications0 t/ z4 ]. U4 ]
7.9.2 Other Composite Applications7 u, I. P- G8 y7 p' p
Chapter 8 Applications of Electron Beam Radiation( ?$ O% e$ ?+ Q: c! v! d/ Q/ J4 C* K; ^
8.1 EB Processing in the Wire and Cable Technology1 b% K9 t$ B4 y. ?3 }
8.1.1 Equipment and Process" J- Z( i; H+ \2 ^3 D
8.1.2 Recent Developments and Trends- a* l+ K( N# R* L& l
8.2 EB Processing in Tire Technology- p, ~, p2 z3 r+ V: G- d9 v
8.3 EB Processing in the Manufacture of Polyolefin Foams
; A, K; d" m7 q7 X! t/ v1 Y/ m8.3.1 Foam Expansion and Its Control
) a( {7 R6 S" x. t( O( h' ?2 E8.3.2 Manufacturing Processes/ c4 i& ?% H$ S% k) p% J
8.3.3 Comparison of Chemical and Radiation Processes! H, b3 u e' q- p/ C7 S
8.4 EB Processing in the Production of Heat-Shrinkable Materials: q& ~$ b. W+ l2 K' h
8.4.1 Heat-Shrinkable Tubing0 Q" Y/ ] [# r
8.4.2 Heat-Shrinkable Sheets and Films# j$ K" _+ O8 J% K; A
8.5 EB Processing in Coatings, Adhesives, Paints and Printing Inks* C3 b( v! C; ]- A. X$ B$ E
8.5.1 Magnetic Media
+ s2 E0 k9 L/ M# m! n: R8.5.2 Coatings
+ }1 n8 h A- @8.5.3 Printing and Graphic Arts; J1 V% J8 s" {9 S
8.5.4 Adhesives
, ^* |/ o& J E3 k8.5.4.1 Pressure-Sensitive Adhesives (PSAs)
" K+ N+ U$ U& v! a0 `, b6 A, m8.5.4.2 Laminating Adhesives
. L4 V/ C9 F/ Q6 Q1 b7 ]: \# X4 ^6 A8.5.5 Polymeric Fiber-Reinforced Composites
$ a& ?1 ~( U& x5 W9 S: T: v3 y' aReferences
' S" f: S- j- F5 l; z( I5 gChapter 9 Dosimetry and Radiometry
2 y. A1 i. {2 h* Z7 {9.1 EB Dosimetry" L- M, Y( ?, `' H! L( ]& r: ~
9.2 UV Radiometry
8 ~" X9 g p$ A9 Y9 K8 G# F' q6 ]! A9.2.1 Actinometers) N- x$ I. E5 K
9.2.2 Radiometers3 q8 P( q6 W p$ E4 @
9.2.3 Radiachromic Films
2 ~! q% Q+ R( u- b/ j4 [References: s Q4 e1 c+ m
Chapter 10 Safety and Hygiene% G+ @* i+ S% E" _8 S, ?1 ^$ ?
10.1 UV Equipment Health and Safety7 L3 w- K& t+ J9 k. U
10.2 EB Equipment Health and Safety
: M# k6 @5 ~' M V10.3 Chemical Hazards
. y# h" j; Y/ W2 @& OReferences
% l- u1 |( P4 a$ j3 {, nChapter 11 Recent Developments and Trends" r7 D3 N8 @) x
11.1 Current Trends in Equipment and Chemistry
+ m! i8 t1 }, i' n( S* ]5 ~$ e1 T11.1.1 UV/EB Equipment z7 ^) o- C; v0 V3 J0 g: ^) {7 s9 A
11.1.2 Chemistry
6 e6 b8 y8 T& e1 o11.2 Emerging Technologies9 R/ ~, O& d) |. o& `8 r/ q
References0 \! Z% v* H# E, X
Appendix I- I- P4 s! { C& Y1 x
Bibliography/ m+ K1 B: n! h5 o7 E$ F8 L
Appendix II
) e9 F- M4 M$ R' ^6 NMajor Equipment Manufacturers
2 r8 B# z. Z: J. ], F; jGlossary) u0 L$ q A0 T
9 ~) n4 j9 M2 u0 R! {( W4 e: L[ 本帖最后由 benzone 于 2007-12-10 13:31 编辑 ] |
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