|
|
马上注册，结识高手，享用更多资源，轻松玩转三维网社区。
您需要 登录 才可以下载或查看，没有帐号？注册
x
Radiation Technology for Polymers
& B* d, [/ [* G
1 o& c/ b( P- e) S% q8 ~. pby Jiri G. Drobny! {6 X9 t: ^$ K& V5 j3 W) p5 u
Publisher: CRC; 1 edition (November 25, 2002)
" { n! |6 g: \8 ?$ xLanguage: English
% u: P! ]: C6 Q, C" K& {! \1 {ISBN-10: 1587161087 % H2 J2 S5 ]+ k. v1 P6 o C
ISBN-13: 978-1587161087
! M5 }' A8 P* O* O2 D2 T
5 |8 S- v' J7 a- ~6 L/ sBook Description& e! }7 B( b+ ?) b: }8 q
The industrial use of ultraviolet (UV) and electron beam (EB) radiation is growing rapidly and now penetrates an ever-widening range of applications, including electronics, printing, packaging. Resources and references for seasoned professionals abound, but few effectively introduce the field to newcomers or provide fast access to specifics on UV and EB effects on particular materials. This book does both. Radiation Technology for Polymers systematically presents the practical aspects of using UV and EB radiation to treat polymeric materials. Drawing on more than 30 years of engineering experience in polymer processing, the author describes the production and properties of UV and EB energy, explores processes associated with both types of radiation, and provides a detailed overview of their applications. He concludes with a look at recent developments and emerging trends in equipment, chemistry, and technologies. Whether you are an engineer or scientist new to radiation technology or a product or process designer researching the effects of radiation on a specific material, Radiation Technology for Polymers is the place begin your search for information. It offers a complete overview of the technology and provides valuable direction to sources of more specific, detailed data.
+ n' k7 N$ V& s
" I7 n2 O3 O# A; h3 gBook Info
C; p' x/ E8 T5 fCovers the processing of thermoplastics and elastomers in film, sheets and other forms as well as coatings, paints, inks, and adhesives. Presents detailed reaction schemes in a simplified manner. Offers a complete overview of the technology of radiation processing.
, d" K( ?7 ]* q) V4 Q3 @. V {" }, c3 i
$ j; K* D% p% p4 [& \1 YContents
# i# J, b- g0 M) b. I' M9 _' ?0 d! bChapter 1 Introduction! G, H+ M3 j0 Z2 \
1.1 Basic Concepts
" {6 {4 k; B' a" t% eReferences* |+ F& j" ?( Z* P$ O
Chapter 2 Producing UV and EB Energy
& u! d$ U/ |( Y) r1 d2.1 UV Energy and its Properties
* k: q& \ o x8 R% C2.1.1 Light Emission from Mercury Gas Discharge
! D. Z% S% q; k3 o4 ~7 N2.1.2 Light Emission from a Microwave Excited Discharge4 ^6 h0 j1 h/ I# a" c
2.1.3 Generation of Monochromatic UV Radiation
0 e* p0 Q$ U$ h. W6 s2.2 Electron Beam Energy and Its Properties
- X5 O% i ^+ T4 gReferences
( _5 ~- @8 x' q' |Chapter 3 Ultraviolet and Electron Beam Curing Equipment3 D- E' W2 U, o5 s+ m# d4 @
3.1 UV Curing Equipment W+ o2 g2 C! ~ ^
3.1.1 Lamps( V. D" @7 }2 [' g+ X
3.1.1.1 Medium-Pressure Arc Lamps. u3 E0 Z i! U7 H4 S+ T1 r2 V
3.1.1.2 Electrodeless Lamps
0 ~4 w4 b& Q5 o! f1 Z J3.1.1.3 Low-Pressure Mercury Lamps
. m: F$ E7 r9 p7 [0 `; j7 t, z3.1.1.4 High-Pressure Mercury Lamps
' ]+ X+ u$ Q- X z3 J5 t `/ @3.1.1.5 Excimer Lamps
. U1 Y. n' r+ _6 M5 m3.1.1.6 Xenon Lamps. g' N/ X3 b8 r: D- P! P( u# J
3.1.2 Lamp Housing
; {! p+ t6 q3 ]3.1.3 Power Supply and Control Systems1 C4 t0 V& a6 U4 |" [
3.1.3.1 Power Supply Systems
3 h" O, y+ }: K9 `3.1.3.2 Control Systems
# M& q- i9 S( W3.2 Electron Beam Curing Equipment' _2 k9 u1 w6 A5 N& a' @0 Q
3.2.1 Particle Accelerators) w" u; h, X T# E3 v+ E$ a* ]1 ]' D. Y
3.2.1.1 Direct Accelerators o- J( V: w* p! A3 ~# h9 \* h% q
3.2.1.2 Indirect Accelerators+ d0 X! P R( L6 f
3.2.1.3 Low-Energy Electron Accelerators
2 @3 ]4 q1 x) d* c3 q8 i7 F3.2.2 Recent Trends in Development of Electron Beam Curing4 }$ C" T( P4 Z& E
Equipment and Technology% V7 V0 p" j- |6 C
References4 l& I! `+ U; w
: U, z4 L! x- J; }. H- Y2 n
Chapter 4 Ultraviolet Radiation Processes
; A: v* t/ p- I) D& ]4.1 Basic Concepts" `) K+ S( K& s, w+ n1 o
4.2 Photoinitiators and Photosensitizers
2 F, I4 V* s) i: v2 q; j4.2.1 Free Radical Photonitiators, m; ?2 i# s( v( Z6 c, {/ U
4.2.1.1 Type I Photoinitiators: C; ]! B5 N- h. Y* u2 v
4.2.1.2 Type II Photoinitiators8 H1 o- f& Q: l
4.2.2 Cationic Photoinitiators) z% C$ i5 |* S" _% r% s7 A& G
4.2.3 Anionic Photoinitiators
% I: S( M/ w! L a8 m9 _ r! m4.2.4 Oxygen Inhibition of Cure
$ O/ n) _% [+ Z4 {+ q' _/ t4.2.5 Initiation of UV Hybrid Curing# X9 q8 k! ^5 H4 O
4.3 Kinetics of Photoinitiated Reactions Y/ f; h/ d( W8 s( ]
4.3.1 Kinetics of Free Radical Photopolymerization8 R- V. R0 L8 ?' K1 H, q4 c
4.3.2 Kinetics of Cationic Photopolymerization3 \* o. Z4 N6 U
4.4 Chemical Systems in UV Processing0 @& Z8 C/ G4 A$ D1 \
4.4.1 Free Radical-Initiated Systems
0 h) J: u) P! z/ Z: |: f4.4.1.1 Acrylate/Methacrylate Systems
' V8 g2 H' Q+ o4.4.1.2 Styrene/Unsaturated Polyesters
) u0 K, o4 |) E4 o4.4.1.3 Vinyl Ether/Unsaturated Esters
3 `% a1 o& ~! w& J" _# F q4 B2 x0 E$ X4.4.1.4 Thiol-ene Systems
# {$ K, I) O3 _6 Y6 b3 Q4.4.1.5 Donor-Acceptor Complexes
* m3 e" I% C# C- ?4.4.2 Cationic Systems
1 }. `, V/ G( x6 A. V0 _; B$ z4.5 Photocross-linking of Polymers( x) P9 j# r, d
References
7 b0 U9 K7 g3 U! c9 K& hChapter 5 Electron Beam Processes
: Q- C, g5 ?' t& T. j: f+ G5.1 Radiation Cross-link Promoters
! y |; j2 V8 `( g5.1.1 Indirect Cross-link Promoters- |" y- C+ y" R5 A
5.1.1.1 Halogenated Compounds
& h- ^/ `; f3 |5 q& x1 _( M5.1.1.2 Nitrous Oxide
! G7 v' s$ l) l6 T! W; Y5.1.1.3 Sulfur Monochloride4 s9 L0 A& e& A) V9 ^ _( O! y
5.1.1.4 Bases, X2 G7 a! A9 D- |2 ~2 o# a+ \# ~
5.1.2 Direct Cross-link Promoters
6 t% T7 P* H" A# C( ]5.1.2.1 Maleimides
' @: d( h; ~2 ~$ Z ^5.1.2.2 Thiols (Polymercaptans)
% P7 T7 y/ ~# C7 p: j- g( ~5.1.2.3 Acrylic and Allylic Compounds.
( C4 n2 t) [& e# {& ]5 U g1 P5.2 Retardants of Radiation Cross-Linking( m6 Y7 r+ F" n J% {9 _% l
5.3 Electron Beam Processing of Plastics/ Y% N+ Z/ e& l( V: N9 g7 F
5.3.1 Polyolefins1 r. ^! ?* v3 O
5.3.1.1 Polyethylene& U& k Z! V3 z- ^
5.3.1.2 Polypropylene
2 R$ S3 _9 H9 F, {! m6 ?# @, K3 t5.3.2 Polystyrene
0 l" i1 E. E( Q6 ?/ }5.3.3 Polyvinyl Chloride75
, p: S- R5 x! b2 x* {5.3.4 Polymethacrylates and Polyacrylates75
" f/ c0 m, `2 @8 F5.3.5 Polyamides
3 F& ]! X9 @3 ^5.3.6 Polyesters
1 q- U9 A2 ~$ n9 m5.3.7 Fluoroplastics
A0 G, c# Y( \6 ]5.3.7.1 Polytetrafluoroethylene
5 o. r# w" }0 u. e( Z9 b1 R3 a, d0 H" z5.3.7.2 FEP6 k" w* G2 [2 q- G2 T- o
5.3.7.3 Other Fluoroplastics3 {: ]) Y5 t7 q
5.4 Electron Beam Processing of Elastomers
* X, Q8 |- f% X) \5.4.1 Physical Properties of Radiation Cross-linked Elastomers6 f/ | ^0 f6 q8 v* t/ p. k
5.4.2 Effects of Radiation on Individual Elastomers
5 ^( T" w: n g6 Z5.4.2.1 Natural Rubber and Synthetic Polyisoprene2 f" o, o; b7 Z9 y, Y: m3 t$ T
5.4.2.2 Polybutadiene and Its Copolymers
( R, {: g! \2 B6 P! q# F5.4.2.3 Polyisobutylene and Its Copolymers& I& J# H9 d) h" l! P5 j
5.4.2.4 Ethylene-Propylene Copolymers and Terpolymers
5 _0 d4 T+ c! n) r9 C5.4.2.5 Polychloroprene7 y2 [6 ]$ G. c
5.4.2.6 Silicone Elastomers
7 Q8 ^. H/ l4 {5.4.2.7 Fluorocarbon Elastomers$ G" d3 w7 h' j0 l" ?, M
5.4.2.8 Fluorosilicone Elastomers
8 k2 o- u4 X8 P; T! H* A5.5 Electron Beam Processing of Liquid Systems* |) L$ _! s5 B+ f/ w7 l4 E! v
5.6 Grafting and Other Polymer Modifications! N5 P8 P4 Q9 l* S% J
5.6.1 Grafting/ Z8 {' |# }! B/ w; L3 e. k
5.6.2 Other Polymer Modifications' u, G* V# z8 @5 `+ a3 Z
References
$ _+ ^ T2 {6 |3 A6 e. K, UChapter 6 Coating Methods Used in UV and EB Technology
% m6 K ` X+ |1 t) p( g* i6.1 Roll Coating8 M: [9 u$ Y6 u. _( x
6.1.1 Direct Roll Coating
) D% ~ m4 K& P8 s. ]5 }" P' [6.1.2 Reverse Roll Coating* w" H+ t; z; R) S, u! |
6.2 Curtain Coating( p+ Y9 m+ n# s! w$ G, M H
6.3 Spray Application$ G5 q8 m. W* i7 J% b" }; j* j$ y
6.3.1 Compressed Air Gun Spraying. Z; e8 `/ |* H3 d# q6 O% ~; _
6.3.2 Airless Gun Spraying
( d3 Q* `. c2 V/ ]% D6.4 Dip Coating6 v% i' N3 p. w0 D. P. s
6.5 Flow Coating
( a2 D" L/ W0 R: v# v9 N% h2 }! o. @6.6 Spin Coating
+ I# X. ?; _2 a4 @) V/ k9 q7 K6.7 Rod Coating
& u2 S1 \( h$ k$ m$ K7 T" AReferences
6 a; ~2 l3 m, A6 Q3 aChapter 7 Applications of UV Radiation$ L' D8 c1 l+ B/ U0 L
7.1 UV Curing of Coatings and Paints
3 D1 {6 V6 s$ |7 e2 ?7.1.1 Functional and Decorative Coatings
; Q- @: |6 q r9 l- }* o7.1.1.1 Coatings on Flat, Rigid Substrates- D% z4 d' f. x% @0 x( O$ l
7.1.1.2 UV Curing of Coatings on Flexible Substrates
: \$ B/ X, f! s6 |0 l! C. N7.1.2 UV Curing of Lacquers, Varnishes and Paints
4 x5 `+ n0 J: B* c7.1.3 Three-Dimensional Curing' o5 J: `, l" E5 I" a' _
7.1.4 UV Curing of Coatings and Inks on Cylindrical Parts, C0 U8 Y! ?1 Z9 m
7.1.5 UV Matting of Coatings& T7 q4 Z8 @. ~" U! G9 b
7.2 UV Curing of Adhesives
, I7 s3 i0 l3 Q3 A' s$ k7.3 UV-Cured Silicone Release Coatings
/ }! B/ i3 i" C, C. q: i2 \7.4 Spot Curing
. \! D( `6 b/ I9 L1 R7.5 UV Curing in Printing and Graphic Arts" |1 G" d+ n+ G, {7 Z; _
7.5.1 Screen Printing& Z3 Q5 K# F+ K. ~5 L
7.5.2 Flexography% k9 X. _. a/ l2 P8 C) W# s' A
7.5.3 Letterpress and Offset Letterpress (Dry Offset)
3 v0 Z! N1 u) _4 h$ m/ U; ]7.5.4 Lithography" J, ~0 u! e1 s1 F% u
7.5.5 Rotogravure Printing4 n/ e' d6 z# v$ [$ F+ V
7.6 Rapid Prototyping
" Y) u: H9 \2 `/ h$ F* ]/ h) J8 j2 ^4 b7.7 UV Powder Coatings" e* ]& ^/ E2 o0 ]
7.7.1 The Chemistry of UV-Curable Powders
1 h4 `6 O& I6 ?" s0 H( \7.7.2 Material and Substrate Preparation
# K2 u2 X& `1 M2 N7.7.3 Powder Coating Application8 _7 P# @' v4 A. V7 z
7.7.4 Substrates Suitable for UV Powder Coating
7 w! k3 L( V+ J- w" t7.7.4.1 Plastics
+ ]6 x0 y' H7 Q$ P o0 M7.7.4.2 Wood and Wood Composites
9 Y. O7 T/ T8 z# t7.7.4.3 Preassembled Parts
8 b" y: ^. \" }" @; y% s( R7.7.4.4 Large-Mass Parts% M- e e" K! b, I$ A
7.7.5 Applications
5 Z/ k6 A& k& S/ ], J- _8 y1 |7.8 Other Applications for UV Curing
# L" L7 z; F7 H( o# _9 s7.8.1 Electronics
* Z2 c& V' [4 U) l# O7.8.2 Optical Components and Optoelectronic Applications
: P, h/ V4 d; ~2 k/ a0 A7.8.2.1 Optical Fibers1 C7 {4 V9 Q6 L; ^- Z Z' a& l" y3 D
7.8.2.2 Other Optical and Optoelectronic Applications3 Q6 T3 {& d" c* N$ S8 a
7.9 Production of Composites: ^) F# G4 ~, }
7.9.1 Dental Applications4 K6 ]+ i9 T1 w( X. ^6 h
7.9.2 Other Composite Applications
/ Z V" G9 n* xChapter 8 Applications of Electron Beam Radiation' A z7 T B8 N% p
8.1 EB Processing in the Wire and Cable Technology9 P4 a8 c4 w3 O
8.1.1 Equipment and Process
/ m0 k+ _0 T3 E/ t( b! {. Z8.1.2 Recent Developments and Trends
( Y- [. s+ z @3 [/ E$ \8.2 EB Processing in Tire Technology
l. b. R/ w, E& l% b. e$ Q8.3 EB Processing in the Manufacture of Polyolefin Foams" g. M/ S3 H: R2 O; W+ D3 l
8.3.1 Foam Expansion and Its Control
7 k1 i3 H- v; D6 Y9 {7 F B! B8.3.2 Manufacturing Processes; I" u. f7 F n9 f2 f) D
8.3.3 Comparison of Chemical and Radiation Processes$ J3 d6 T( U5 i; s
8.4 EB Processing in the Production of Heat-Shrinkable Materials0 V8 p V9 t+ j1 x
8.4.1 Heat-Shrinkable Tubing& z8 e' }- ~2 I7 l
8.4.2 Heat-Shrinkable Sheets and Films- D7 d% {/ Y3 D' R2 t
8.5 EB Processing in Coatings, Adhesives, Paints and Printing Inks; X" F5 D+ _6 g- O! ?( f8 o$ K& v. y
8.5.1 Magnetic Media2 l5 ^" r( x. \% B; u2 Z
8.5.2 Coatings6 G6 U7 U. _/ p2 Q7 P- L: o
8.5.3 Printing and Graphic Arts0 ]$ T' t. D2 b- ?6 I
8.5.4 Adhesives; x: f% { O( P1 c) z
8.5.4.1 Pressure-Sensitive Adhesives (PSAs)+ q0 b" U% C! l+ N2 `( H
8.5.4.2 Laminating Adhesives- A- f/ U2 q8 \- V: l
8.5.5 Polymeric Fiber-Reinforced Composites: w K* d) X \; ^
References% J- n2 H% u7 l* Q5 M0 B
Chapter 9 Dosimetry and Radiometry& c( d3 |* f8 i: v9 ^+ }+ o8 p
9.1 EB Dosimetry9 c: _4 O6 {- }1 X) d
9.2 UV Radiometry
+ R4 K: Y$ B1 \9.2.1 Actinometers. D# M- j; U1 c7 B
9.2.2 Radiometers3 B! {( j/ K7 e. p: I& u" |/ V
9.2.3 Radiachromic Films8 I3 J+ I9 X7 A
References& ?: H- `- x" D; ~
Chapter 10 Safety and Hygiene
' ^( g, ]+ K, @( [8 x, g1 Z1 B10.1 UV Equipment Health and Safety! p% O+ e' w# y
10.2 EB Equipment Health and Safety
0 B2 D7 i7 F% {10.3 Chemical Hazards+ c0 x* }" F) ~- I/ _
References
, H8 ?3 X+ J+ s& nChapter 11 Recent Developments and Trends
0 V! t+ V) |# {+ q/ ?% R11.1 Current Trends in Equipment and Chemistry
" i5 k0 l) y7 I& v7 c11.1.1 UV/EB Equipment u" F9 Q. C( A N7 D* G
11.1.2 Chemistry) }* L( f. H2 ~# L; u( z
11.2 Emerging Technologies
Q% q* t* R3 FReferences
: |4 A4 `2 w* b9 ] i( HAppendix I+ n" J) [, n3 k' R% @
Bibliography
0 u! k) @4 D6 w) e8 G6 f& d- ~Appendix II
1 o9 {6 J) h" }4 y3 FMajor Equipment Manufacturers
9 t7 d: V# D2 E& {Glossary( k" K7 w6 U T- W
- R# ?2 g+ V6 l* e
[ 本帖最后由 benzone 于 2007-12-10 13:31 编辑 ] |
评分
-
查看全部评分
|
[复制链接]
发表于 2007-12-10 13:24:27
