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[已解决] 请问有谁能说说铁佛龙是怎样焊接的??

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发表于 2007-10-19 15:29:02 | 显示全部楼层 |阅读模式 来自: 中国陕西西安

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我们做线路板设备的,有时用到铁佛龙这个材料,不过由于焊接技术的不成熟,使用时有很大的局限性,在三维上看能不能找到一些好的解决方法!
发表于 2007-10-19 20:56:17 | 显示全部楼层 来自: 中国辽宁沈阳
聚四氟乙烯在熔点以上(380℃)其黏度仍有1010~1011Pa·s,即使加高温度也只会分解而不流动,因此对聚四氟乙烯材料的焊接区别于其他热塑性塑料。聚四氟乙烯的焊接有热压焊和热风焊两种,热压焊接是将焊接的两片PTFE材料加热至高于熔点,在不太大的压力下,将两片材料压合在一起。热风焊接是用与聚四氟乙烯性能相仿的熔融加工的氟塑料如四氟乙烯-全氟烷基能乙烯基醚共聚物(PFA)作焊条,用热空气将焊条与待焊的聚四氟乙烯同时加热、加压,使聚四氟乙烯材料通过焊条连接在一起。

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发表于 2007-11-16 18:40:38 | 显示全部楼层 来自: 英国
? 基本不能焊...2楼说的只针对膜...厚点就不行了..# u$ ?/ H: v6 M& g+ v9 Q
能具体说说电路板哪边要用PTFE? 如果是加工PTFE电路板..怎么会需要焊接的?
发表于 2007-11-16 20:09:05 | 显示全部楼层 来自: 英国
查了下..还是可以焊的..把资料给你..5 s. q2 f$ J" |  Q1 a
16.4 Welding and Joining4 f, S3 u5 S5 t/ }- Z" y8 t4 i
The bonding techniques involving adhesives are
3 x- E4 O- e+ s$ H( l& knormally suitable for applications where the fluoropolymer
5 N6 e! g) d8 E3 b1 v( F7 B- E4 |does not carry large loads such as those
& N9 J! h6 d; wexperienced by chemical processing equipment.
5 ^! f2 X. p  rWelding or adhesiveless joining is a method by which
# t' v. n$ W8 `" D$ _/ G4 g1 nparts for load-bearing applications are manufactured.
' w6 ~+ m) ^$ MThe load could consist of temperature, chemical corrosion,9 K3 _3 S3 C% o$ M! t! H+ H( N
and force. This method also known as welding
  ^8 R3 y5 d1 ?# @4 Cor joining allows economical fabrication of complex4 d. k5 l# G2 y, _, O1 u
parts by joining individual components.0 a& z) X2 t& C- t& H9 x7 @4 t4 ]
It is possible to obtain a good bond between fluoropolymers2 [3 }+ U. b, |& ?- R: H
themselves, without the use of adhesives,& F( @4 C, t4 O# k5 L3 R9 K
by application of heat and pressure. Pressure can help
- e% {" ?/ k& T% C5 g* a' X! _drive the molten polymer into the pores of the substrate.
+ J; d7 Y6 h$ J5 _/ dBond strength is dependent on the mechanical
; Y2 o& V1 q8 D& I% S; x# h6 Cinterlocking that is achieved by the adhesion mechanism,/ n2 R4 G/ C; A& ~& i: V& |
improving with increased surface roughness of; b% G8 y/ Y$ j6 q2 r" J
the substrate. Examples of parts made by this technology
" D; G( @' `3 T& H' X% ^( R# yinclude glass cloth-backed polytetrafluoroethylene0 l3 f2 N* z8 Q7 n% V$ }! E! r- x
sheet, or multi-ply circuit board and coated
6 S/ A: s0 X! t5 Ealuminum or copper sheet. Achieving this type of, O4 g8 c+ ~8 j8 M  I% m
bonding is more complex with polytetrafluoroethylene
, M( a! \5 {# E  h9 g0 Y0 Uthan melt processible polymers. PTFE does not flow
9 w( l* W7 Z! D* |" P4 s" V2 O6 qafter melting due to its extremely high viscosity.4 B6 U" d; w1 q4 i/ Q' U. G! H' C) h4 B
It is possible to achieve adhesiveless bonding using
7 _+ F0 T" }+ ~% O# d; v1 j% ustandard PTFE in special applications where the# q$ x% O/ z6 \! f$ |
polymer can be heated to a temperature well above its* C4 f& e5 ]# x* z
melting point. It can then be forced under pressure8 U$ B1 q! q1 f/ g) [
into the substrate surface. These polymers are not% N: Z" k- |. _4 T8 g  U  I
suitable for applications where the geometry of the
0 k4 n5 B- k1 Y3 J- {9 p9 rjoining objects must be preserved, contact surfaces
0 T5 d5 ?1 W+ [2 i1 D( _4 Tare smooth, or the objects being bonded are too large.! n2 a( J- G9 W" G( x
In such cases, a different type of polytetrafluoroethylene* k+ u5 f  ]3 z0 c+ s
is required.
1 K3 A# L4 P( {) M0 g6 |Polytetrafluoroethylene for these applications is
5 O8 ^, w! s5 O2 B4 G  Aknown as “modified” which refers to the presence of4 I7 Q+ L$ G0 n3 {( Q
a small amount of a second perfluorinated monomer,1 ]6 A8 O, h) i/ K6 i, ?1 P4 c
known as a modifier, in its structure. The modifier
! K. v) O2 S  b! a( I& Pmolecule always contains a pendent group. The9 y* d1 N; t/ x2 I3 D% P
preparation method of this type of PTFE has been described
6 U. [* q* ?( b- C1 ~4 a; T+ W& Fin Ch. 5. Its commercial grades have been
% V" v* l3 W1 Wdescribed in Ch. 6.6 J- F5 ^' l# \3 m3 |0 Z1 n
How does it work? A simple explanation is offered( K6 t; h- ^6 t6 ]6 Z7 T, S0 Y
here, based on the author’s own experience. The
% l" W3 J) Z; z4 T" M3 }: s  bmodification reduces the molecular weight of the polymer,& J, q7 V7 D* r# b; f% ^
which in turn reduces its melt viscosity. Lower
/ Q8 x/ M" P3 x0 J& s; X) _melt viscosity increases the mobility of the polytetrafluoroethylene4 h0 A& D3 d: [- R
chains. This facilitates diffusion and* ]3 E. p% C/ u) a" `% Y7 \* J! s
entanglement of polymer chains at the bonding interface.
8 Z/ a( C/ N  f4 y0 l. }9 C7 KThe pendent group of the modifier disrupts the0 E5 E( w" R1 f; ?) u  h3 I
crystals of PTFE, thus preventing excessive crystallization.
$ X- U, h$ w0 PCrystallinity which is too high results in poor- e; R; ?( P5 J+ b/ w' N/ v8 z
mechanical properties such as poor tensile and flex5 z  b. x  d1 P& N6 e& V  d
properties. An optimally modified PTFE has good! @7 R  X9 g7 n+ o. E- @$ K
mechanical properties in addition to weldability.$ N  E/ n2 Q% h
Welding can be achieved using PTFE made by, C& c  O3 N  y' H' F5 s' }
dispersion or suspension polymerization. Most applications$ p# [" h# g2 c; _* e8 J% D& z
involve welding of parts made from granular
, P8 C" s6 j1 @0 }) Cresins (suspension polymer). Dispersion polymerized& X% ]" _6 I; X& T' U, D# Z* a$ G
PTFE is also used for application such as wire  x2 v" S" O7 J4 K5 R
coating. A thin (50–100 μm) tape of the “modified”7 X+ m: }3 y/ R  e( r
polytetrafluoroethylene is wrapped around the conductor2 ]9 K0 u7 j# A2 q( W: ]. b
followed by sintering. The layers of the tape
0 F. B% {8 i, s; ^adhere to each other and form a solid insulation, due
" P* T2 I7 U/ u3 V" d" U+ bto its good interlayer adhesion, around the conductor1 L% q; ^6 t. J% p  R) o9 m
at the completion of sintering cycle.
8 E( p( _" w. Z6 s16.4.1 Welding Technique
: e2 M3 ]% y, W+ e. _& EQuality of a welded area is defined by the strength& T2 Y2 B" P3 I( X( u# H
of the bond. One of the ways to measure bond strength% P- g/ m5 U% i* W) b' E# d
is to cut a microtensile bar specimen in such a way- l9 ^3 [/ \% y4 e2 Z1 s# \
that the weld line would fall near its center (Fig. 16.5).- @! p; l! Y5 ?" `- c7 q" @" r2 V
Tensile strength and elongation can be determined by. U. J* K' R8 V3 I
extensiometry. Weld factor is defined by Eq. 16.1 as
% q8 }" {# q  R4 O; N8 bthe ratio of tensile strength of the welded specimen
' q6 {- z8 ~9 l7 C0 {* [(Tw) to the tensile strength of the material (Tp). The( ^5 u: Z  A1 D, r+ t
weld factor is defined for the weakest polymer, if two
" Z! a/ \* x4 b6 Q# Adifferent polymers are welded together.
6 s$ x  S  w$ MThree variables are significant in welding a given* w/ [( z) `' j4 W! r: J8 _  F
modified PTFE part: welding temperature, pressure, X8 Z) _. F0 f9 J, K5 }
and time. Optimal combinations of these three pa
: g# Y' B( r7 ~1 x" i4 M& Urameters must be found for successful welding of parts." _* |. ]( D3 X4 q4 x
Temperature should be well above the melting point
7 m( F4 W  r, U) o+ j(320–330°C), typically in the range of 360–380°C.0 k2 e2 b2 K3 p1 `
Little pressure is required to weld the parts after reaching- A- b3 I1 R( X
gel state. Less than 350 kPa, and often less than5 h, P( h- {  ~4 n- ^+ V
35 kPa, pressure is required for welding. It is normally$ w6 E. ?* T1 Z5 [: m
not possible to trade higher welding pressure
% x+ p5 s  r- V- z# ?8 I4 ^/ sfor lower temperature and vice versa. Time, the third
0 F2 J" G5 }: F+ j/ r7 m& gvariable of the process, is dependent on the size and  x( I( }) O' R+ p+ o5 W" t0 T1 q
shape of the part. The actual weld time, defined as3 m0 E: f& E2 p3 g
time at the final temperature, is of the order of 1–2" r9 X$ V5 _5 L
minutes. It often takes a great deal longer to heat up4 k: m" p3 l/ w5 ~
the part to the welding temperature. High heating rates+ B* }" E$ K5 `# J5 L9 u4 Q7 O6 }
do not accelerate the process due to the low thermal
" N* P  n" z6 W' @* A; ~5 d& uconductivity of PTFE. Heat rates similar to those of& ^3 D6 y, A/ Q0 p$ M+ Y
sintering cycles of preforms can be expected.5 y% Z& F! A3 {( u4 [6 s
The mating surfaces should be smooth and uniform
1 N1 Z5 J! `# `; ?4 `6 aand free from any contamination. Unsintered
1 K1 t. \* Z: N9 ]* u: Spreforms and sintered parts of modified polytetrafluoroethylene, x# ^) S8 k3 B4 o. V# ~" b& Y
can be welded. Sintering and welding can
" h2 J% h, l, \8 `be combined. Parts can often be stacked up in the  w2 m, I  r' f; R7 y9 v9 c$ O6 _0 d
sintering oven without additional pressure. A weld
; a/ V: _/ G! O1 Y  ]factor of one can be routinely obtained in the combined
, i9 E1 ~5 O9 z6 I: ~9 \9 ]process. A higher pressure is required for welding
5 H  `% [$ @: H+ x6 xsintered parts to counteract the residual stresses,
& p' n* m8 R  N0 owhich tend to move the parts upon release. It is important' F* W# k2 V- f+ l0 G! M/ i
to cool the welded parts slowly to minimize3 r* A: f# v0 a6 O5 L" _
stresses stored in the part. Figure 16.6 illustrates a
# @9 ^6 I9 y- T/ T# N& Kdevice for hot-tool welding films and sheets./ y! H2 D. ?8 A  O. J
Figure 16.7 shows a comparison of the stressstrain
" R0 n- J8 `" i3 kcurves of a conventional and a modified PTFE0 V6 K8 [. p6 U+ g
for the original and welded material. The weld line in
7 u2 R$ v6 Y! x, Xconventional PTFE when welded to itself, at best, fails, E1 I- `: K1 b$ @
at very low strains. In the case of modified resin, I1 r3 @* d8 J, A3 o5 {" X; e9 Z
welded to itself, the weld factor attains value of 0.80–
- A% z) k+ v4 d0.85. Weld factors for welding of conventional and1 a. H' ]# g2 o0 B  T1 j0 N; ~
modified PTFE have been reported in the range of
' h) I3 A* X! d8 G0.66–0.87.[13]! v4 P) }2 K  Y4 g+ R
Another method is welding with the help of a PFA
0 h" h8 \2 O7 x( }(melt processable) rod. In this case, the conventional
7 I2 R5 x' c/ U6 Por modified PTFE is heated by hot air near the seam
2 n$ C: R* j/ R. T$ A: ountil it is in gel state. The PFA rod is molten and used
6 X) j2 {( l+ n" _: sto fill the seam.
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