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Radiation Technology for Polymers3 y* T3 p4 d+ G5 V
/ w: P5 B, ~( S. H
by Jiri G. Drobny+ r+ e7 |3 y8 z; X4 }+ i- y
Publisher: CRC; 1 edition (November 25, 2002)
+ _7 K: s, d# z) v2 n& U+ lLanguage: English 6 Q8 W! y) D6 P8 [ H
ISBN-10: 1587161087
( |, ?! b/ p# r$ ?* {, kISBN-13: 978-1587161087 + c* k" w- d. ^( P0 D1 s" I+ Y X/ y3 W
* o; Q9 x& N! F- d E1 f* yBook Description0 l7 @3 ^0 C. v9 a3 M* b$ n1 u/ g
The industrial use of ultraviolet (UV) and electron beam (EB) radiation is growing rapidly and now penetrates an ever-widening range of applications, including electronics, printing, packaging. Resources and references for seasoned professionals abound, but few effectively introduce the field to newcomers or provide fast access to specifics on UV and EB effects on particular materials. This book does both. Radiation Technology for Polymers systematically presents the practical aspects of using UV and EB radiation to treat polymeric materials. Drawing on more than 30 years of engineering experience in polymer processing, the author describes the production and properties of UV and EB energy, explores processes associated with both types of radiation, and provides a detailed overview of their applications. He concludes with a look at recent developments and emerging trends in equipment, chemistry, and technologies. Whether you are an engineer or scientist new to radiation technology or a product or process designer researching the effects of radiation on a specific material, Radiation Technology for Polymers is the place begin your search for information. It offers a complete overview of the technology and provides valuable direction to sources of more specific, detailed data.
4 L* h0 w/ _" u9 }2 W
9 Z5 @' j( \; e. X7 j W1 R8 VBook Info
0 {3 c! q7 F( N! `5 K7 S# w0 ACovers the processing of thermoplastics and elastomers in film, sheets and other forms as well as coatings, paints, inks, and adhesives. Presents detailed reaction schemes in a simplified manner. Offers a complete overview of the technology of radiation processing.1 o1 k% r# F5 s0 r9 t
; w# I) Q6 M5 H
+ f5 b) I k. A; E H7 G$ v- iContents
6 L4 b9 Z+ z" O# R5 `5 I0 aChapter 1 Introduction
( v! T/ R8 l; d& g) K3 ]1.1 Basic Concepts
2 u8 M! o5 a( @- mReferences* b7 |7 [# s2 e
Chapter 2 Producing UV and EB Energy
4 p, J" O: ^/ J$ L/ K* n2.1 UV Energy and its Properties
* w* T M @6 b; U# @, `2.1.1 Light Emission from Mercury Gas Discharge5 q# U( h& I+ W, z& D
2.1.2 Light Emission from a Microwave Excited Discharge
. y$ e; h( K3 o( z2 z; [2 ^8 J2.1.3 Generation of Monochromatic UV Radiation1 P6 }# X1 `8 B0 ~
2.2 Electron Beam Energy and Its Properties
, j$ y! L4 \# x f% l5 n: x" z7 [References
# N6 l* o; A% [; J" xChapter 3 Ultraviolet and Electron Beam Curing Equipment
& ]$ M! v" d( }& S4 T X2 K: a3.1 UV Curing Equipment( d# G; q( K' L( M# g/ D* e
3.1.1 Lamps: S% _) L$ H5 S7 t
3.1.1.1 Medium-Pressure Arc Lamps8 e2 K! w4 E, @7 n
3.1.1.2 Electrodeless Lamps5 ~) ^- j% Z* A- Y
3.1.1.3 Low-Pressure Mercury Lamps5 G* @" F( t4 S: t) j# q0 l
3.1.1.4 High-Pressure Mercury Lamps; Y, B+ d5 S( Q4 V5 t
3.1.1.5 Excimer Lamps
6 Z" @9 y) w4 {# _" ^% L# {3.1.1.6 Xenon Lamps
7 u* @8 ]5 R/ f9 a8 d1 _" }, N3.1.2 Lamp Housing8 S% j2 ^5 k$ t5 C! B
3.1.3 Power Supply and Control Systems
1 f# {+ y' B& H0 D3.1.3.1 Power Supply Systems" A4 ~1 A! N- S0 R% x0 b6 R
3.1.3.2 Control Systems! n2 m* g( a% q) q6 E7 y4 Y
3.2 Electron Beam Curing Equipment
4 s1 [/ w( ~, [' ^3.2.1 Particle Accelerators
. g% w8 P$ ~4 `3.2.1.1 Direct Accelerators
+ P; x+ \ [' X( V4 K( j6 A% w3.2.1.2 Indirect Accelerators g v) Q4 z" S
3.2.1.3 Low-Energy Electron Accelerators# i0 b7 @3 b) N4 ]
3.2.2 Recent Trends in Development of Electron Beam Curing
! o8 h; L. Y" u& p' P+ U6 E- Z% [2 kEquipment and Technology0 ?; H# f* V. T
References# H, K' Z( {3 o0 W) d. y2 X" t, N
- l6 l# U" Z+ h$ l* F( M& XChapter 4 Ultraviolet Radiation Processes
, j% N# n# P& v1 m- ?9 |4.1 Basic Concepts& s4 o6 g. G! l1 G
4.2 Photoinitiators and Photosensitizers0 k7 Y' S" {/ O0 g- R( w+ ?6 A, n7 M/ y
4.2.1 Free Radical Photonitiators
! T' F0 M$ c8 h4.2.1.1 Type I Photoinitiators9 h, A, X2 l: ~* P' u
4.2.1.2 Type II Photoinitiators) Z% z; }0 s; |/ z/ V! h" d2 \
4.2.2 Cationic Photoinitiators
# U9 d8 w3 U/ `2 ^4 B2 R1 a4.2.3 Anionic Photoinitiators5 W. h1 b% e2 Z8 c; U8 T
4.2.4 Oxygen Inhibition of Cure
2 u4 H' I0 y$ p4.2.5 Initiation of UV Hybrid Curing: c5 E: X2 _* e2 h6 ?! C8 \/ `: x
4.3 Kinetics of Photoinitiated Reactions
6 o. Z% Z6 M- g' A# n4.3.1 Kinetics of Free Radical Photopolymerization
6 J# X5 c) L/ N& k, T4.3.2 Kinetics of Cationic Photopolymerization& b/ b; G7 M7 o8 K1 f% n
4.4 Chemical Systems in UV Processing0 U' K' c0 w( z3 s
4.4.1 Free Radical-Initiated Systems
* }+ U. m4 o1 i1 B k" S) K4.4.1.1 Acrylate/Methacrylate Systems% m5 T) j9 Q8 ?/ ^$ C
4.4.1.2 Styrene/Unsaturated Polyesters
?' r$ u, N$ ]4.4.1.3 Vinyl Ether/Unsaturated Esters
: S9 L1 a% g3 {6 W; ?( ^4.4.1.4 Thiol-ene Systems: P$ u9 m% L& Z( ` H
4.4.1.5 Donor-Acceptor Complexes
; B8 L c% h. `$ z5 D6 G4.4.2 Cationic Systems6 H3 s2 y0 Z0 y! I& ^$ i/ d4 Z
4.5 Photocross-linking of Polymers+ P5 S" J# ^) T0 {: _
References
% U- Z* w' w, ~, \0 K8 ^% F/ yChapter 5 Electron Beam Processes- {2 o- l6 @5 U0 s: M; A
5.1 Radiation Cross-link Promoters
( H# ]8 n) m8 ~; M6 t5.1.1 Indirect Cross-link Promoters0 `3 Q+ X( |- m y: g& h
5.1.1.1 Halogenated Compounds/ V9 D2 {, {' L! j- b0 y6 {
5.1.1.2 Nitrous Oxide% S9 K# t- Z" l7 T& s
5.1.1.3 Sulfur Monochloride
+ ]4 ^- ]7 f9 r4 B5.1.1.4 Bases+ q( r# f3 u8 L' H# ^7 ?) M4 b7 h
5.1.2 Direct Cross-link Promoters2 q: m7 [$ W+ F4 b J
5.1.2.1 Maleimides+ ]$ M) D2 }0 P2 {! B: N! J
5.1.2.2 Thiols (Polymercaptans)
7 T0 [- \; [+ s: ^. n5.1.2.3 Acrylic and Allylic Compounds.0 p8 C8 X8 ^" J) k; N, Y2 v, G6 W
5.2 Retardants of Radiation Cross-Linking
+ p' j1 w7 g7 B# u: [* a- ?5.3 Electron Beam Processing of Plastics& @8 s6 A! a9 Z$ f! r+ w
5.3.1 Polyolefins$ @3 j' |/ Z K2 W) L
5.3.1.1 Polyethylene
* |! h1 ]: j1 [0 z6 {1 C5.3.1.2 Polypropylene9 A1 ^0 P( m/ e9 Y) t( i, k
5.3.2 Polystyrene: L+ z$ y5 q% r. \# v
5.3.3 Polyvinyl Chloride75
. Y) ~3 u1 t3 s4 |- i3 L5.3.4 Polymethacrylates and Polyacrylates75
' S) Y$ i- [; F! k" F% m- i' A5.3.5 Polyamides
7 J4 k' y8 P; j8 A" J ]" l5.3.6 Polyesters
8 z1 O2 |4 ^: J) m5.3.7 Fluoroplastics7 T7 H$ z$ \& k7 y# t9 Y
5.3.7.1 Polytetrafluoroethylene
5 I6 o* a) X2 v: U" ~; K5.3.7.2 FEP! Q$ h' v2 p$ h0 }- b- G& t, [
5.3.7.3 Other Fluoroplastics) U" X& [) Q, Z) F( i
5.4 Electron Beam Processing of Elastomers) W0 O/ G- s6 n9 B
5.4.1 Physical Properties of Radiation Cross-linked Elastomers
# a; M! R$ t0 i5 ~( w5.4.2 Effects of Radiation on Individual Elastomers( ]) Y3 w' r8 t U: J [
5.4.2.1 Natural Rubber and Synthetic Polyisoprene
~6 L3 v f @ N( G5.4.2.2 Polybutadiene and Its Copolymers
# f0 t( f) n; k2 P6 Y( q; E5.4.2.3 Polyisobutylene and Its Copolymers5 s) @6 u5 g T6 t
5.4.2.4 Ethylene-Propylene Copolymers and Terpolymers
7 @, u$ H; k2 Y) u1 ?0 E! {5.4.2.5 Polychloroprene# k( n# H) x& x' H7 \4 V6 }( C0 F
5.4.2.6 Silicone Elastomers
, `+ j" N3 x3 q6 r" \; F1 j5.4.2.7 Fluorocarbon Elastomers
: }$ G6 b3 r l; @2 W, k! M3 |* q3 V5.4.2.8 Fluorosilicone Elastomers% t/ Q& b7 |* @7 H0 b" z
5.5 Electron Beam Processing of Liquid Systems/ R& m; r' P# i9 N- I
5.6 Grafting and Other Polymer Modifications
$ F5 i( i% K3 D& p" c$ b5.6.1 Grafting
! ^/ C" n8 D8 r* g& G, Q" @5.6.2 Other Polymer Modifications/ W( M7 l2 W# e! U9 [5 x. k4 r6 R( M7 Q
References
; O+ E, G4 ?% G% P- qChapter 6 Coating Methods Used in UV and EB Technology
/ c5 |; {: t' ?$ g2 i. G7 E; S6.1 Roll Coating
- S& R/ H( g p4 A) C$ k6.1.1 Direct Roll Coating
6 R2 Z6 l, ^8 S0 L6 Z5 R$ K6.1.2 Reverse Roll Coating6 a6 [5 N9 V a2 }
6.2 Curtain Coating
0 p: w* H. h& B6.3 Spray Application; U# C- G2 f. _, E
6.3.1 Compressed Air Gun Spraying5 E( C" ~3 n; g) ^
6.3.2 Airless Gun Spraying4 g" }7 J; ]+ j* l
6.4 Dip Coating
* F; F4 b. E1 G6 L. w6.5 Flow Coating3 A( z% e8 `1 T7 t. h a
6.6 Spin Coating! P6 J( x0 B2 E+ I3 w2 C3 \
6.7 Rod Coating4 P3 \- H/ |0 J- E( R
References1 m7 v8 h4 Y& [, i' i% Y& z
Chapter 7 Applications of UV Radiation. Y/ }5 B9 A4 A
7.1 UV Curing of Coatings and Paints. b) ^. \7 Z# q: Y
7.1.1 Functional and Decorative Coatings
$ E1 r+ |* K) N5 F- P7.1.1.1 Coatings on Flat, Rigid Substrates: q8 p N; ]& `3 w2 g a U0 K" X
7.1.1.2 UV Curing of Coatings on Flexible Substrates
$ _1 ?$ @" A! h& m7.1.2 UV Curing of Lacquers, Varnishes and Paints m3 O/ R$ a/ e0 N1 D
7.1.3 Three-Dimensional Curing
0 B- s1 H* o7 k7.1.4 UV Curing of Coatings and Inks on Cylindrical Parts- [; X' h. w& J w- C
7.1.5 UV Matting of Coatings
0 P9 j: l: U3 Y# I- q7.2 UV Curing of Adhesives
# `: g, M2 n7 @5 N7 I3 I7.3 UV-Cured Silicone Release Coatings( l/ Z* i( u& }0 f) j& t
7.4 Spot Curing
' ?% Y: ~/ e5 i- \8 V$ `: n. K7.5 UV Curing in Printing and Graphic Arts
0 I8 Z g- h! m" b( M' z7.5.1 Screen Printing
$ W3 l/ f2 { y* |4 b7.5.2 Flexography
$ C7 P7 ~1 D) D* h+ T+ g( s/ m" O7.5.3 Letterpress and Offset Letterpress (Dry Offset)
3 Z9 U, F0 p8 y. S( r7.5.4 Lithography
: k- s; i1 G( O! u( X* b9 A7.5.5 Rotogravure Printing0 h2 @- d% Y% v' J5 `) d5 r
7.6 Rapid Prototyping
! F+ i6 h0 B* ^6 a# w2 {7.7 UV Powder Coatings
5 I/ r7 g. [, E, k$ R5 I7.7.1 The Chemistry of UV-Curable Powders7 E, P/ H' n; D# v# F) F$ D
7.7.2 Material and Substrate Preparation
: d P" H$ X/ h9 \' d7.7.3 Powder Coating Application
H. O# D) @+ U7 ]7.7.4 Substrates Suitable for UV Powder Coating
+ w c4 l$ r: [, b9 ]3 H4 f7 h7.7.4.1 Plastics
/ j8 L+ G0 L v; }5 c7 D7.7.4.2 Wood and Wood Composites9 _. \: m. t9 C2 H4 s% g
7.7.4.3 Preassembled Parts, ?* }1 m( U& ~% O* X, l
7.7.4.4 Large-Mass Parts
0 k B/ X9 y, K/ b2 H( [" \7 g+ b: U7.7.5 Applications
+ D! N: }- W, @$ B% i3 u7.8 Other Applications for UV Curing& O/ C& t6 `9 V1 p
7.8.1 Electronics
! O7 L3 b! k( Z, P8 E" Y7.8.2 Optical Components and Optoelectronic Applications+ G p. ?+ i! a
7.8.2.1 Optical Fibers( S) P9 O6 j' ]$ N3 L7 m
7.8.2.2 Other Optical and Optoelectronic Applications0 V( ~5 J1 F; ]( Q P S
7.9 Production of Composites
, S8 T8 Q! `; F7.9.1 Dental Applications
) V/ k- @' P3 g) K! A7.9.2 Other Composite Applications
) r/ Y0 o3 X& N/ K' Z/ YChapter 8 Applications of Electron Beam Radiation8 `* j1 j1 }" S& \5 T9 A0 e) A( a- o
8.1 EB Processing in the Wire and Cable Technology
+ o z! W, H4 }$ e, I8.1.1 Equipment and Process; |; A Z1 w1 M; _# x! C: L( h
8.1.2 Recent Developments and Trends
z t" _$ i' U* V' W8.2 EB Processing in Tire Technology
: t2 w3 [$ B" Y, L8.3 EB Processing in the Manufacture of Polyolefin Foams! M. h3 L6 E y, I9 j2 { ~; M
8.3.1 Foam Expansion and Its Control4 F2 o2 T. _4 u
8.3.2 Manufacturing Processes* k h8 T1 Y7 f8 K. b
8.3.3 Comparison of Chemical and Radiation Processes
1 P+ G4 d/ h4 M8.4 EB Processing in the Production of Heat-Shrinkable Materials
/ |& i" J1 J) ~% y" Q8.4.1 Heat-Shrinkable Tubing7 O, u" @7 m. W# h% Y
8.4.2 Heat-Shrinkable Sheets and Films( M: O. g3 [! E
8.5 EB Processing in Coatings, Adhesives, Paints and Printing Inks4 h+ A* G6 l+ y" u; w; |
8.5.1 Magnetic Media
; j* v6 E, s! Q6 |8.5.2 Coatings$ G3 L* C. M3 p9 H& J8 t2 P0 z6 g
8.5.3 Printing and Graphic Arts4 s; H6 {6 l% s8 T! a
8.5.4 Adhesives
& m% h( a" ?9 T8.5.4.1 Pressure-Sensitive Adhesives (PSAs)$ z% b+ Q m/ g6 w+ E
8.5.4.2 Laminating Adhesives" d& f5 ^9 i8 w9 ]: E( o
8.5.5 Polymeric Fiber-Reinforced Composites
& b! i( b7 l0 l' _References6 }1 t& Y0 {+ K5 q
Chapter 9 Dosimetry and Radiometry1 K6 E! \, g! r5 i9 ~
9.1 EB Dosimetry" C- v9 x$ ?0 `. L, E$ j* `
9.2 UV Radiometry
. `6 S% I: G& d! g) @9.2.1 Actinometers
! `& E1 \1 O; H2 [5 g5 r+ d! D9 S9.2.2 Radiometers
2 J4 N% h9 A4 k, |9.2.3 Radiachromic Films0 |& z @$ k( Q- z9 O$ g; [9 e
References* Z( y ]) Q7 M7 M
Chapter 10 Safety and Hygiene
. K/ h6 r+ c% o" m$ s: o% R0 @6 b10.1 UV Equipment Health and Safety: x# H7 f; x3 e9 b7 u
10.2 EB Equipment Health and Safety
, p5 `' y/ h. K' ~10.3 Chemical Hazards" [/ p! B9 Q1 K' z0 F# p
References& ^4 Z0 u& _8 I, ` W, m: f& _% S6 o" r
Chapter 11 Recent Developments and Trends
- J7 [7 |2 Z& n& Q11.1 Current Trends in Equipment and Chemistry
# e( u( X9 s( U; P1 R# |4 }6 e11.1.1 UV/EB Equipment
. f6 G% Z" S2 ?% z/ A/ q11.1.2 Chemistry' X" A& t$ x9 p2 J* k- D i6 Z
11.2 Emerging Technologies
6 Q" i. X' F @- _( }' H5 UReferences6 }7 x6 |+ c( ]: a4 H2 I# Z
Appendix I) h" ?- b0 G3 ?1 I( z! `+ T
Bibliography1 [7 b) S8 P9 j
Appendix II/ X* l- ?4 U1 G0 a
Major Equipment Manufacturers- L$ o! s! D; I) L1 `
Glossary% B# p& N: J9 }
+ V e$ Q; }7 r[ 本帖最后由 benzone 于 2007-12-10 13:31 编辑 ] |
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