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[已解决] 请问有谁能说说铁佛龙是怎样焊接的??

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发表于 2007-10-19 15:29:02 | 显示全部楼层 |阅读模式 来自: 中国陕西西安

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我们做线路板设备的,有时用到铁佛龙这个材料,不过由于焊接技术的不成熟,使用时有很大的局限性,在三维上看能不能找到一些好的解决方法!
发表于 2007-10-19 20:56:17 | 显示全部楼层 来自: 中国辽宁沈阳
聚四氟乙烯在熔点以上(380℃)其黏度仍有1010~1011Pa·s,即使加高温度也只会分解而不流动,因此对聚四氟乙烯材料的焊接区别于其他热塑性塑料。聚四氟乙烯的焊接有热压焊和热风焊两种,热压焊接是将焊接的两片PTFE材料加热至高于熔点,在不太大的压力下,将两片材料压合在一起。热风焊接是用与聚四氟乙烯性能相仿的熔融加工的氟塑料如四氟乙烯-全氟烷基能乙烯基醚共聚物(PFA)作焊条,用热空气将焊条与待焊的聚四氟乙烯同时加热、加压,使聚四氟乙烯材料通过焊条连接在一起。

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发表于 2007-11-16 18:40:38 | 显示全部楼层 来自: 英国
? 基本不能焊...2楼说的只针对膜...厚点就不行了..( z8 r+ A, }0 G( H5 q- y+ v" o3 ^8 V
能具体说说电路板哪边要用PTFE? 如果是加工PTFE电路板..怎么会需要焊接的?
发表于 2007-11-16 20:09:05 | 显示全部楼层 来自: 英国
查了下..还是可以焊的..把资料给你..
; T6 J+ j( S& _: J* B5 o1 X16.4 Welding and Joining1 Z+ a5 `6 ^5 P# q* D
The bonding techniques involving adhesives are
# q0 {% H: `* l3 qnormally suitable for applications where the fluoropolymer9 G( G0 U3 Q$ E! s( r; }
does not carry large loads such as those  d- ]0 H& ^3 K2 ^
experienced by chemical processing equipment.1 P. v  Z2 v, C$ N8 U  m
Welding or adhesiveless joining is a method by which* O- R7 l" C' b) c6 f
parts for load-bearing applications are manufactured.* ]2 ^: K0 E; P& X- W1 C
The load could consist of temperature, chemical corrosion,; @, _& Y$ |3 V' p3 v% F% ~
and force. This method also known as welding- w" D$ ]3 s  e2 b8 a- Y5 o( A4 t
or joining allows economical fabrication of complex
6 n$ c8 G% ]; s6 `1 @. M, Dparts by joining individual components.0 G6 }2 w  Z1 m( w( w/ O3 `5 d/ D( z
It is possible to obtain a good bond between fluoropolymers0 S+ R3 n& O1 h& J0 h4 c
themselves, without the use of adhesives,! F9 t. M1 ^  t  b$ K( B
by application of heat and pressure. Pressure can help% h5 Z7 |9 g8 o9 H
drive the molten polymer into the pores of the substrate./ F. d- L& b, x5 h+ _; F9 d
Bond strength is dependent on the mechanical6 f2 \5 G8 k% Z( t' q1 D# d
interlocking that is achieved by the adhesion mechanism," T. m  K/ U. W. [$ ^6 z6 P
improving with increased surface roughness of
/ D( B6 p/ r/ ~' H- h8 c/ q3 ithe substrate. Examples of parts made by this technology: _4 g/ z- ]4 z% X0 [8 E# ]1 d4 `
include glass cloth-backed polytetrafluoroethylene
0 o! U3 u& v5 D  W' O& {sheet, or multi-ply circuit board and coated7 ^( v7 n( b; K: d
aluminum or copper sheet. Achieving this type of
  S/ Y. E% [5 n% r+ {bonding is more complex with polytetrafluoroethylene
: }0 K* m2 K6 K1 h1 f% B- B: nthan melt processible polymers. PTFE does not flow# X& {* F* b, F! \! }1 I+ k
after melting due to its extremely high viscosity.
( g: G! c% K7 ]7 bIt is possible to achieve adhesiveless bonding using
& M7 s# V5 S  J0 z( ~0 @# }4 ?standard PTFE in special applications where the
1 m7 S, D2 N; o, D9 Z& s/ S4 Fpolymer can be heated to a temperature well above its0 I" O2 n# L! l) [3 @9 A; T: \
melting point. It can then be forced under pressure0 b8 z( N, T8 h1 d
into the substrate surface. These polymers are not
; P5 p, n/ o+ L7 T0 y* q* Bsuitable for applications where the geometry of the
5 B5 }5 f# b- c) \0 Y# Ijoining objects must be preserved, contact surfaces4 C$ e5 I* X5 O# n' p% a. ]
are smooth, or the objects being bonded are too large.
$ I7 \, N* c( C0 _+ q& a; O0 iIn such cases, a different type of polytetrafluoroethylene
# ~5 N% c5 C( X: m* J; [is required.
3 E+ r8 B. t4 p- e9 E! z  nPolytetrafluoroethylene for these applications is$ x7 v7 |/ a2 e/ G
known as “modified” which refers to the presence of* L4 ~; f% ~: X
a small amount of a second perfluorinated monomer,
+ H2 {+ ~3 ~5 d8 i8 D# l9 `$ _1 H) z. eknown as a modifier, in its structure. The modifier5 P% u0 v5 y' U( ~" b
molecule always contains a pendent group. The
8 u& x$ o  V% tpreparation method of this type of PTFE has been described/ n( s2 R  f0 ?- q
in Ch. 5. Its commercial grades have been' z/ q% P1 ?/ U0 d* g: K
described in Ch. 6.
2 P2 Q5 E) S6 K& ^How does it work? A simple explanation is offered
" Q6 L9 D3 o; n& e' y' O/ f' Rhere, based on the author’s own experience. The
' Y0 E0 }$ ?" f$ k, _3 l, ^+ Xmodification reduces the molecular weight of the polymer,8 @. C+ ?/ z  w" ^' ^' k9 B" q' w
which in turn reduces its melt viscosity. Lower
$ W, w' T5 ]/ a: ymelt viscosity increases the mobility of the polytetrafluoroethylene6 F8 H; F, V  N  ~
chains. This facilitates diffusion and
6 |, r2 s. S! z* f0 H. `- _entanglement of polymer chains at the bonding interface.
; K$ W$ ~& \0 q, x- d* B! ?% jThe pendent group of the modifier disrupts the7 V. _1 i, H+ I! M: D
crystals of PTFE, thus preventing excessive crystallization.+ q* a3 `8 M6 r0 E. I7 u4 K
Crystallinity which is too high results in poor
4 R: @$ d! {, A  C2 B* bmechanical properties such as poor tensile and flex% @% L/ A' E! b
properties. An optimally modified PTFE has good, T) Z% B) e9 }4 M! [4 f* ]* p
mechanical properties in addition to weldability.! X* q# |& {' ^4 |% h
Welding can be achieved using PTFE made by
2 j' O0 t( Q7 Mdispersion or suspension polymerization. Most applications# s; j' [" P; a" D9 }& `# m- c
involve welding of parts made from granular3 ?: w: W; ^9 m$ h9 F( ~
resins (suspension polymer). Dispersion polymerized8 \3 t5 X6 O& @
PTFE is also used for application such as wire+ S! ?0 `" e& D, T" l: s
coating. A thin (50–100 μm) tape of the “modified”  o; X* \; ^' N6 U1 S1 `
polytetrafluoroethylene is wrapped around the conductor: e$ Q! `9 H/ y$ U
followed by sintering. The layers of the tape  d0 \# H' x- i! y" J2 N
adhere to each other and form a solid insulation, due* X9 }4 d* D- i4 J; w1 d
to its good interlayer adhesion, around the conductor
, `$ ^# ~7 K. k- K& Uat the completion of sintering cycle.
" w" p) F' ^, {( `0 g16.4.1 Welding Technique  F0 f$ P! s6 t4 I
Quality of a welded area is defined by the strength/ f# C2 n- |" _- t5 e* T
of the bond. One of the ways to measure bond strength
% D6 w! o/ L( p% \9 h* ?. i$ Lis to cut a microtensile bar specimen in such a way
% F9 a* z% V2 q6 _1 E9 j" Tthat the weld line would fall near its center (Fig. 16.5).
' u4 j5 |" J  ^& O7 H4 C+ jTensile strength and elongation can be determined by$ a; L# w: |; j( O* o. \: ^
extensiometry. Weld factor is defined by Eq. 16.1 as" O  K! e- E  J4 ?+ G
the ratio of tensile strength of the welded specimen; t6 j8 ^* n! N  k
(Tw) to the tensile strength of the material (Tp). The" k  a$ K" ~8 Q0 y) f+ e; X& K
weld factor is defined for the weakest polymer, if two
) z) V- _% ~: d# t% r: Kdifferent polymers are welded together.
# I4 t* d9 V0 h3 D+ r) f5 AThree variables are significant in welding a given0 z5 W3 l1 T% [3 @/ }; \
modified PTFE part: welding temperature, pressure
! G2 n3 f# v4 U: ^3 Qand time. Optimal combinations of these three pa
' _+ [. B- h6 M7 n3 c% arameters must be found for successful welding of parts.8 c1 H9 ^. Y. [  b# C. y
Temperature should be well above the melting point
7 H. ~: W* A* S(320–330°C), typically in the range of 360–380°C.
7 ^! a- K( S' F( e3 W; {. dLittle pressure is required to weld the parts after reaching. p4 b0 O! d$ n4 k
gel state. Less than 350 kPa, and often less than
+ G* q% q' ?2 c% o7 e. c: h35 kPa, pressure is required for welding. It is normally( D, u2 d4 E) z9 G/ y
not possible to trade higher welding pressure
  S7 Q; n$ f; u' F8 s5 o, xfor lower temperature and vice versa. Time, the third
, i& {, Y* m$ C* y# G. Gvariable of the process, is dependent on the size and
7 F5 S' }; I1 O- A( h& A3 y" sshape of the part. The actual weld time, defined as" K* D6 \5 b" W& C7 W: e
time at the final temperature, is of the order of 1–28 O& g, {. S' \& @0 }
minutes. It often takes a great deal longer to heat up
9 Q+ y# a% K6 j+ b6 Nthe part to the welding temperature. High heating rates
: `0 \5 U; Z5 V  b; d& F) U$ Bdo not accelerate the process due to the low thermal$ Q% p/ B2 C9 {1 N, F
conductivity of PTFE. Heat rates similar to those of
3 S; w. t, M$ Y7 x/ }sintering cycles of preforms can be expected.
0 _: j* ]4 i6 S) j( K* fThe mating surfaces should be smooth and uniform
/ l, R" F* L7 t; C3 n5 Nand free from any contamination. Unsintered
" n8 w7 e4 q: P2 L& q% opreforms and sintered parts of modified polytetrafluoroethylene- r) K' N  {8 \; ~  ]; H6 B9 Z
can be welded. Sintering and welding can
/ l: `) m0 g& s/ B" Q1 }) Y$ q' ]be combined. Parts can often be stacked up in the
) E' j' K) n  S5 ]8 {- [; lsintering oven without additional pressure. A weld  P: J! k. C- \" o8 {2 Y+ b
factor of one can be routinely obtained in the combined
8 i* c/ ^% f+ V# Z4 [8 Pprocess. A higher pressure is required for welding1 f7 W3 v5 U: W8 |
sintered parts to counteract the residual stresses,
5 \+ V# m/ z' Wwhich tend to move the parts upon release. It is important. ~9 R  X' W- S* t# P
to cool the welded parts slowly to minimize
# e! n7 C2 _8 R# v6 |  vstresses stored in the part. Figure 16.6 illustrates a' Z# ]- j/ x7 p- h
device for hot-tool welding films and sheets.$ p, {3 F6 v  T5 g$ ?* s
Figure 16.7 shows a comparison of the stressstrain
* ~7 \6 F) U7 M& C. x2 g; H, Ucurves of a conventional and a modified PTFE
, n; `8 f2 j! s' Nfor the original and welded material. The weld line in
* ?+ M6 g2 N5 ?5 d& a# Xconventional PTFE when welded to itself, at best, fails* j  }- [- [* Q1 q5 V- y% t. c
at very low strains. In the case of modified resin
, H; r  X; X8 w, j. l+ U8 ^% jwelded to itself, the weld factor attains value of 0.80–
; D( u2 u) R* J/ S' @5 l0.85. Weld factors for welding of conventional and7 y  O# ?' g# @- m  J, s
modified PTFE have been reported in the range of
+ k" h- K2 l5 X: X9 B9 t0.66–0.87.[13]
  r- u- M2 w: ]( v1 hAnother method is welding with the help of a PFA
. P) F( d! I1 u  l(melt processable) rod. In this case, the conventional
2 i" }. y4 L# N' u/ i9 v6 c# v3 Bor modified PTFE is heated by hot air near the seam
! q& r4 @5 J/ quntil it is in gel state. The PFA rod is molten and used2 y( C0 c4 X! w, `5 E5 n
to fill the seam.
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