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发表于 2007-11-16 20:09:05
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: v0 l: D. r/ {% G& {) X" f" q16.4 Welding and Joining$ K2 j8 P: B2 f/ ~7 O
The bonding techniques involving adhesives are! z% n8 D; P6 ]- ~ b
normally suitable for applications where the fluoropolymer* m* F: O" K2 D1 b
does not carry large loads such as those
: a1 Y! f9 }8 K+ y/ H: @9 V3 [experienced by chemical processing equipment.
( u z _# f$ ?" G. HWelding or adhesiveless joining is a method by which' D+ A- E0 @# X1 l% c9 k! b
parts for load-bearing applications are manufactured./ v. s% u& q- m5 j' o- V! J% r, U, G
The load could consist of temperature, chemical corrosion,
1 o# |) e5 H6 Y" s+ Sand force. This method also known as welding
: Z" C) I' G& {+ [% c+ e4 @or joining allows economical fabrication of complex
1 ~/ \$ m3 d$ bparts by joining individual components.- a2 f- q! `+ B( i6 b# f. w3 g
It is possible to obtain a good bond between fluoropolymers2 N. Z% W B$ V8 p8 J- e3 x
themselves, without the use of adhesives,
0 q! F) J( }+ I# v. b6 t1 S# X) i* Aby application of heat and pressure. Pressure can help3 E5 v& W! A7 u3 ?
drive the molten polymer into the pores of the substrate.
: |$ E3 ?1 [$ e5 i T6 d: c( qBond strength is dependent on the mechanical
3 m/ s( ^/ s6 M: {2 hinterlocking that is achieved by the adhesion mechanism,) V# I8 ?3 b, r3 u% c, L' m
improving with increased surface roughness of
$ S0 d& J- n: ~' `& R- r9 g/ {0 gthe substrate. Examples of parts made by this technology/ _8 ?1 c$ Z4 T9 y3 e/ L8 I: {
include glass cloth-backed polytetrafluoroethylene
6 w" P9 W. d' Y% {8 Zsheet, or multi-ply circuit board and coated u6 y% e4 Z. p; Q; i
aluminum or copper sheet. Achieving this type of. a, i' X. t. j6 g0 d
bonding is more complex with polytetrafluoroethylene( G. [7 z; j8 ~, {- F5 y& l* E+ W
than melt processible polymers. PTFE does not flow: y- O. P! R7 x0 O( @6 V+ `) E
after melting due to its extremely high viscosity.. K$ L1 O$ y( L6 h
It is possible to achieve adhesiveless bonding using. K% W. j6 U+ F! K6 g, U* i
standard PTFE in special applications where the/ k' T+ R7 V! ]4 A; ?
polymer can be heated to a temperature well above its- @/ o, i. U( t$ c6 j" w! \
melting point. It can then be forced under pressure
9 x+ ]( t! p0 E# minto the substrate surface. These polymers are not5 K+ {; o, \8 f; \7 _0 W
suitable for applications where the geometry of the6 \/ l' ]3 J7 S6 p( \+ l
joining objects must be preserved, contact surfaces
5 `+ y4 E* ?2 G: i1 M r4 J% zare smooth, or the objects being bonded are too large.
& h- O/ b% B: FIn such cases, a different type of polytetrafluoroethylene+ S8 ^0 q5 {! E" l
is required.
% ^& ^1 h8 s+ Q% a+ i6 _$ TPolytetrafluoroethylene for these applications is8 U3 X, l. I; b2 `6 Z9 r
known as “modified” which refers to the presence of
3 f! f' R4 A* W: Ia small amount of a second perfluorinated monomer,7 X: D' g: V. v- v7 }% K; x
known as a modifier, in its structure. The modifier" Z" u3 L2 Y$ n: s. G( e8 F) T7 M- {1 q
molecule always contains a pendent group. The# _ P* @" S" t8 i) d3 a) d7 Z
preparation method of this type of PTFE has been described
* [9 R; \1 }# ]: |- |: Uin Ch. 5. Its commercial grades have been
% ?4 e" f' u' X9 B* f8 b) q* jdescribed in Ch. 6." Q" F3 Q) B W3 i: n! g
How does it work? A simple explanation is offered
& ], b) u- M9 ?" i" v5 D2 Dhere, based on the author’s own experience. The
3 q; v: O9 m4 w5 s9 x/ t1 Lmodification reduces the molecular weight of the polymer,& a7 y* q: H' W! V
which in turn reduces its melt viscosity. Lower
" b z. ?0 x& f0 W& N; Xmelt viscosity increases the mobility of the polytetrafluoroethylene
& \1 j1 K# \. w- x! h: S8 cchains. This facilitates diffusion and
% z& _7 e5 D5 z* B" o1 l% Pentanglement of polymer chains at the bonding interface.0 f2 C. R5 }- a' R! ] ~7 m2 U
The pendent group of the modifier disrupts the! ^3 N2 F6 Z2 _2 }% y: B i
crystals of PTFE, thus preventing excessive crystallization.3 J/ Y9 P. t% W
Crystallinity which is too high results in poor
) z6 n& f, O: O/ Emechanical properties such as poor tensile and flex
2 T r5 o( W' `6 }properties. An optimally modified PTFE has good/ f7 P g& C0 `' c. j2 A
mechanical properties in addition to weldability.' c9 J! `7 ?/ D) j% z+ d
Welding can be achieved using PTFE made by
) `5 u4 ~% O3 a2 xdispersion or suspension polymerization. Most applications3 J7 o1 F% m* d) L" W
involve welding of parts made from granular. W5 S- q8 y5 m. t. E: W
resins (suspension polymer). Dispersion polymerized7 d. p6 x# z6 K& c. l
PTFE is also used for application such as wire
6 o |( L J3 a( M5 k1 L8 dcoating. A thin (50–100 μm) tape of the “modified”
, h6 p% E8 f# n3 x- q: _. a& m' Bpolytetrafluoroethylene is wrapped around the conductor" p8 @% _) |' B7 [" N
followed by sintering. The layers of the tape1 f- c7 u0 w7 @6 a* }2 Q
adhere to each other and form a solid insulation, due$ R; ]- P; r n7 P2 S: p4 L# A b
to its good interlayer adhesion, around the conductor& S7 o" j* `) H2 V2 s+ a" M
at the completion of sintering cycle., A5 c/ M$ a6 H( I. W" z
16.4.1 Welding Technique+ a' w" ] t, l3 G
Quality of a welded area is defined by the strength
! n3 I( n$ n" \2 b% H) R. x0 n+ xof the bond. One of the ways to measure bond strength( p( v2 P. k1 d
is to cut a microtensile bar specimen in such a way
" `# B% n5 g: F5 |0 Lthat the weld line would fall near its center (Fig. 16.5).7 {0 H3 O7 T4 [; i" p7 G
Tensile strength and elongation can be determined by
% A Q% R' z( o S- E; j2 r' aextensiometry. Weld factor is defined by Eq. 16.1 as
) `: r& }: C8 |# lthe ratio of tensile strength of the welded specimen
, a+ I5 n9 ?# x& s S$ ^(Tw) to the tensile strength of the material (Tp). The" u, S1 i# n3 D% T0 c! G" T
weld factor is defined for the weakest polymer, if two( L% Y0 p9 `5 G0 f, `6 U9 R
different polymers are welded together.& g$ ?) {, j+ E& \& v( x$ t
Three variables are significant in welding a given/ R& g: S- V' h: G7 q. R2 y/ @. K
modified PTFE part: welding temperature, pressure
2 n. L8 u9 W" s* O9 m: I+ E& ]and time. Optimal combinations of these three pa/ b! q" b# T$ t2 U) M3 ^$ a( [
rameters must be found for successful welding of parts.- c5 ?) n6 t# R* `
Temperature should be well above the melting point7 U c5 u5 E8 U% @% b1 U8 R
(320–330°C), typically in the range of 360–380°C.5 F% n! w) ]$ k
Little pressure is required to weld the parts after reaching
3 X) y4 m+ x- o' ogel state. Less than 350 kPa, and often less than8 X: n# [- l, v
35 kPa, pressure is required for welding. It is normally9 w, ~9 d% c6 X2 V% L
not possible to trade higher welding pressure: \; s9 k2 L% x$ T
for lower temperature and vice versa. Time, the third
: Y- e) G# S7 q0 |5 C- ]; Bvariable of the process, is dependent on the size and
! e7 `* D/ u. Yshape of the part. The actual weld time, defined as
2 e: R1 l. K) W1 N% U* Etime at the final temperature, is of the order of 1–2
$ F# ]7 ~1 v2 Vminutes. It often takes a great deal longer to heat up
V8 C% b. e- l" U6 b! y" ~the part to the welding temperature. High heating rates
2 b V2 O, Y1 X/ y% @6 zdo not accelerate the process due to the low thermal
) V' r/ K% ], ^: H L1 Yconductivity of PTFE. Heat rates similar to those of0 w$ {0 N& d6 _4 T. H) `
sintering cycles of preforms can be expected.$ G w5 z, S* f3 }
The mating surfaces should be smooth and uniform2 s( S+ [/ U! K) N" E _
and free from any contamination. Unsintered
) n& o" `. U6 D* F3 \preforms and sintered parts of modified polytetrafluoroethylene
% e. r1 d. N$ G5 q. @, E; B; {can be welded. Sintering and welding can; t$ d) z$ p+ R( c, V. x
be combined. Parts can often be stacked up in the
& y- g' r8 c% {, D4 Z! usintering oven without additional pressure. A weld0 K- o! O, e3 u! k; i! U
factor of one can be routinely obtained in the combined* S3 P" f5 |$ t# M! i- x
process. A higher pressure is required for welding- P, Q& G; _$ a
sintered parts to counteract the residual stresses,
; r* P6 h8 I/ F; u" v. Wwhich tend to move the parts upon release. It is important: s! J, E! g5 n$ A/ K. E* \8 j- c
to cool the welded parts slowly to minimize7 N$ O* x0 j2 Q: z# F
stresses stored in the part. Figure 16.6 illustrates a
' a7 h2 V/ T% tdevice for hot-tool welding films and sheets.
/ Z% B% Q9 `: B4 T, ]& S5 J. UFigure 16.7 shows a comparison of the stressstrain
. x7 y8 N4 x0 ?. t& Vcurves of a conventional and a modified PTFE
; [! N- ~; s, r1 wfor the original and welded material. The weld line in
+ p: N% c5 `9 V* Lconventional PTFE when welded to itself, at best, fails* B$ m( I7 e; ^, `& g
at very low strains. In the case of modified resin
5 n. V( Z0 Y# D% F2 Q# v, mwelded to itself, the weld factor attains value of 0.80–; s. v3 h; ? C/ D, z. X
0.85. Weld factors for welding of conventional and* L. q( }% i8 _- T6 D
modified PTFE have been reported in the range of
/ K9 s5 w6 w( w6 U. h& D0.66–0.87.[13]
8 R3 s# @' U. H5 MAnother method is welding with the help of a PFA9 F. M# I' B' k- N& X. \
(melt processable) rod. In this case, the conventional, G8 m/ Q8 c( ]# H
or modified PTFE is heated by hot air near the seam; _7 z; z" J' W0 O' j
until it is in gel state. The PFA rod is molten and used0 O+ Z1 H5 @" a. j% Y
to fill the seam. |
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