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Radiation Technology for Polymers) H( `5 s3 W" o* s# M& J
: }* G$ X7 P' P2 Y0 W2 s8 S2 O9 ~/ p2 Y
by Jiri G. Drobny
4 q+ S. B# [) j7 `7 K! X5 k: n! K3 oPublisher: CRC; 1 edition (November 25, 2002) 1 L* b, q F: W5 s" S& T+ \
Language: English
6 V/ h0 V1 B" v( uISBN-10: 1587161087
. D0 t. b4 h) S/ F- OISBN-13: 978-1587161087
# e: z- I5 c; U% D6 p! a v* k7 I; D3 C
Book Description7 ^ ` l3 S2 H M
The industrial use of ultraviolet (UV) and electron beam (EB) radiation is growing rapidly and now penetrates an ever-widening range of applications, including electronics, printing, packaging. Resources and references for seasoned professionals abound, but few effectively introduce the field to newcomers or provide fast access to specifics on UV and EB effects on particular materials. This book does both. Radiation Technology for Polymers systematically presents the practical aspects of using UV and EB radiation to treat polymeric materials. Drawing on more than 30 years of engineering experience in polymer processing, the author describes the production and properties of UV and EB energy, explores processes associated with both types of radiation, and provides a detailed overview of their applications. He concludes with a look at recent developments and emerging trends in equipment, chemistry, and technologies. Whether you are an engineer or scientist new to radiation technology or a product or process designer researching the effects of radiation on a specific material, Radiation Technology for Polymers is the place begin your search for information. It offers a complete overview of the technology and provides valuable direction to sources of more specific, detailed data.
8 H9 b5 A) V. u
3 ?/ o2 }8 g& D! c* X& Z/ q! p3 ~Book Info
* a& k' G1 I2 W4 kCovers the processing of thermoplastics and elastomers in film, sheets and other forms as well as coatings, paints, inks, and adhesives. Presents detailed reaction schemes in a simplified manner. Offers a complete overview of the technology of radiation processing.
5 S9 u/ c! Q2 c- F, z1 g3 i$ g! {, D! k
: C/ G' m9 L7 t5 d6 P: C
Contents
. Z% L0 b: J8 P3 SChapter 1 Introduction
' Q( }' i. m& Q9 j1.1 Basic Concepts
0 L/ e2 V e4 W3 jReferences
; s" n; \6 ~3 G( ZChapter 2 Producing UV and EB Energy
3 i9 q+ ^2 y& X |# ?, { U2.1 UV Energy and its Properties" H6 p$ n0 i1 V; S* l
2.1.1 Light Emission from Mercury Gas Discharge
- ]& ]$ [, k9 ~! E9 ?2.1.2 Light Emission from a Microwave Excited Discharge
/ P- F" d4 Q( X \! i. e+ t2.1.3 Generation of Monochromatic UV Radiation
$ a1 f' {2 J9 X( N$ N; v0 m2.2 Electron Beam Energy and Its Properties. L3 l( Z& y( x9 e. ?& }' }* y
References9 Y- I7 `0 R8 v" w: L
Chapter 3 Ultraviolet and Electron Beam Curing Equipment
6 E1 j/ m7 u4 [7 j" o; h3.1 UV Curing Equipment, u# R+ ?5 v; ~/ q& p$ @1 u
3.1.1 Lamps
' z& q' a6 ?* Q% B3.1.1.1 Medium-Pressure Arc Lamps, a" o- e, x% S5 I
3.1.1.2 Electrodeless Lamps' y2 d. k9 g6 ~% P/ ^
3.1.1.3 Low-Pressure Mercury Lamps
. z$ r9 X) @; K- V3.1.1.4 High-Pressure Mercury Lamps
" w: p7 F1 m8 P3 W6 F6 [, ^0 x2 L3.1.1.5 Excimer Lamps' D0 u. e; L/ }$ G4 }0 P+ v
3.1.1.6 Xenon Lamps
3 G. s( |; W$ h/ o a3.1.2 Lamp Housing
- }% f' A- k" K' `3.1.3 Power Supply and Control Systems
3 e; j3 ^6 K, }7 D6 K- N0 B: B3.1.3.1 Power Supply Systems1 O7 N+ `8 \0 ^, T ?. ~3 L
3.1.3.2 Control Systems
+ r: I3 Z8 q7 j3.2 Electron Beam Curing Equipment& X, ~2 f; N$ V& B
3.2.1 Particle Accelerators# q9 k8 \4 w+ o6 I( a' ?8 a2 m
3.2.1.1 Direct Accelerators
I Z6 w, s2 o5 t3.2.1.2 Indirect Accelerators
8 V/ W; j/ N; K V- z3.2.1.3 Low-Energy Electron Accelerators, Z, H/ f# @. ?5 v. }7 `
3.2.2 Recent Trends in Development of Electron Beam Curing% M! u8 g# w: {9 N
Equipment and Technology8 F+ V. Z2 [2 y; [$ p
References ?6 W2 h" I5 K4 }
2 S6 Z" H# s- I0 ]/ X k
Chapter 4 Ultraviolet Radiation Processes
) ?2 G4 t/ j5 }6 ], O4.1 Basic Concepts
2 U1 E6 @" L4 n7 k. ^3 W4.2 Photoinitiators and Photosensitizers: }9 a" O! s7 v+ e P0 F
4.2.1 Free Radical Photonitiators
( O% M, q& y3 A( X* W1 y! a* ^4.2.1.1 Type I Photoinitiators
$ X" W' P/ w8 k! c2 H# J; {4.2.1.2 Type II Photoinitiators
7 P4 ?9 [! q9 [4.2.2 Cationic Photoinitiators1 d5 |3 e1 t1 w' ^0 h
4.2.3 Anionic Photoinitiators# ~! N) k( d" V) F
4.2.4 Oxygen Inhibition of Cure2 V% `( @8 F. \, j
4.2.5 Initiation of UV Hybrid Curing
4 G( @7 F9 n4 u* ^- I8 o: g4.3 Kinetics of Photoinitiated Reactions3 n) c) l$ }0 }
4.3.1 Kinetics of Free Radical Photopolymerization5 B9 @* h1 M0 z, E' ?
4.3.2 Kinetics of Cationic Photopolymerization
2 Z3 R2 e1 ?1 k) S, F! C( r. r4.4 Chemical Systems in UV Processing" v/ k* M' q: y# A4 q" a+ C# V
4.4.1 Free Radical-Initiated Systems) i. ]. E, u% i* s9 T! \3 a& P
4.4.1.1 Acrylate/Methacrylate Systems5 k- `* r* l+ \8 n
4.4.1.2 Styrene/Unsaturated Polyesters
6 ~1 t; H/ ~# B3 }4.4.1.3 Vinyl Ether/Unsaturated Esters
; e% Q+ m* J/ c1 D2 t4.4.1.4 Thiol-ene Systems5 H- I6 N1 ?, s
4.4.1.5 Donor-Acceptor Complexes
' ?4 e2 k( {' y& P4.4.2 Cationic Systems
/ z& B# l! i$ y1 o4.5 Photocross-linking of Polymers
/ s9 Z* b! z: c0 _) aReferences1 f# C# r+ |# p$ Y+ ~
Chapter 5 Electron Beam Processes
/ W8 L! ]- N8 `# b# B( v5.1 Radiation Cross-link Promoters& P" Q7 k- J4 @/ }9 ^
5.1.1 Indirect Cross-link Promoters
: E1 w' S2 x+ N& h9 ^5.1.1.1 Halogenated Compounds
! O3 W6 b) ~+ Y$ e! n5.1.1.2 Nitrous Oxide
% P. L, o5 y, X& A5.1.1.3 Sulfur Monochloride: P3 E$ ? _' @2 u" { T
5.1.1.4 Bases( z& ^6 [" H1 q& {' P1 _; }
5.1.2 Direct Cross-link Promoters
5 F) t& R( |/ f- m5.1.2.1 Maleimides$ G/ _' Y$ p% n/ G: E* c# _
5.1.2.2 Thiols (Polymercaptans)
" H m% \- G& G) C3 F' E+ Y1 j5.1.2.3 Acrylic and Allylic Compounds.
, X% S! b! g& T. [5.2 Retardants of Radiation Cross-Linking
. V' V2 C: ^) p- c5.3 Electron Beam Processing of Plastics
{5 E/ r: T1 Z$ t: X& F; @ F4 A5.3.1 Polyolefins
% `; {* V2 Y! ~/ m5.3.1.1 Polyethylene+ Y+ v$ A+ c, k2 j, ]5 |5 Z
5.3.1.2 Polypropylene
4 ^: e: s5 @- M) u: ?5.3.2 Polystyrene
$ w: X$ O" W6 I; S5.3.3 Polyvinyl Chloride75! s; f; j( d& x9 c0 W5 I, V. F7 e$ k
5.3.4 Polymethacrylates and Polyacrylates75
5 H8 s$ o6 O+ I I0 M, l, u/ s+ |- u5.3.5 Polyamides8 M; z/ ?6 V( _
5.3.6 Polyesters4 O- n) u& I6 e8 m; c. e
5.3.7 Fluoroplastics+ y% p& x& M. s. Z, _
5.3.7.1 Polytetrafluoroethylene
' I2 p( g$ }5 U7 y6 n# C5.3.7.2 FEP
; y! e. W3 O/ k( F3 ^5.3.7.3 Other Fluoroplastics3 y5 }9 I0 L9 S4 B( f0 ]" }
5.4 Electron Beam Processing of Elastomers
* Y$ t l* s$ Q9 f0 v! p5.4.1 Physical Properties of Radiation Cross-linked Elastomers
: g1 r9 a; s0 o: e) R7 k5.4.2 Effects of Radiation on Individual Elastomers" L( J3 U4 n& m
5.4.2.1 Natural Rubber and Synthetic Polyisoprene2 n6 W: l, \' ?: ^
5.4.2.2 Polybutadiene and Its Copolymers
$ h& S, g3 j- D. n4 B N3 v4 l6 H% P5.4.2.3 Polyisobutylene and Its Copolymers0 X/ S" M" [; \ e
5.4.2.4 Ethylene-Propylene Copolymers and Terpolymers o( b, E4 L: c# b+ O+ B
5.4.2.5 Polychloroprene$ t1 c0 F) A3 u* r; |0 P1 D; h5 n
5.4.2.6 Silicone Elastomers
& R6 ^5 C/ q. ]# i. l& s8 S& q5.4.2.7 Fluorocarbon Elastomers
" v, H) f2 C& o, ^ y# B' e5.4.2.8 Fluorosilicone Elastomers
6 g! M2 O5 o8 L! s" v: U; ?5.5 Electron Beam Processing of Liquid Systems
5 v/ d9 ?( j0 e" N' Y3 m. W8 B$ N5.6 Grafting and Other Polymer Modifications1 m! G! O2 L% K- ^3 h1 A& H
5.6.1 Grafting( t3 V& B7 U9 ` r2 a' g) G
5.6.2 Other Polymer Modifications
; X8 _! U9 k# X" R" j$ c& ]: SReferences
2 }/ R$ v4 `& qChapter 6 Coating Methods Used in UV and EB Technology6 q$ n ]- ^ G
6.1 Roll Coating
# n: k0 Y6 q7 M6.1.1 Direct Roll Coating$ [, R9 z1 s2 {1 w `0 K
6.1.2 Reverse Roll Coating2 U4 I/ a7 o2 }2 U2 Y3 x
6.2 Curtain Coating# V# k2 m# T# ^& ~1 w
6.3 Spray Application' \ ^0 v, {. G h# j6 f7 j( {
6.3.1 Compressed Air Gun Spraying
- s# `% i# [" h/ [6.3.2 Airless Gun Spraying
$ C( h0 e- O( ~! r# x6.4 Dip Coating+ C. l4 }8 Q7 l4 d6 M
6.5 Flow Coating/ {5 G' m) o/ r9 m/ f- D2 k' ^2 S
6.6 Spin Coating
4 g4 S0 U) Q5 G; Y5 ]/ c8 V. W6.7 Rod Coating
2 J& |" ?+ G' w( |References
6 l' q6 M0 Q8 oChapter 7 Applications of UV Radiation& j: @" V8 a/ p& A' `2 l! y5 g
7.1 UV Curing of Coatings and Paints$ A5 z) N y' d# T& z. v
7.1.1 Functional and Decorative Coatings
; f1 V- V6 {# u! g" ~7 Z- |7.1.1.1 Coatings on Flat, Rigid Substrates) z$ X: t+ r; \0 _ k: U k; N
7.1.1.2 UV Curing of Coatings on Flexible Substrates
$ d2 M* y+ ~* N( n/ N2 M7 j% I7.1.2 UV Curing of Lacquers, Varnishes and Paints
4 q k5 c/ m; r R6 O# Q9 f7.1.3 Three-Dimensional Curing) {, L( x3 j5 C+ q% Y3 Z
7.1.4 UV Curing of Coatings and Inks on Cylindrical Parts
# n* I. g2 ~- s0 s7.1.5 UV Matting of Coatings: K8 Z" {* |( j# F
7.2 UV Curing of Adhesives4 G+ Q" T2 x4 C- |) y: R# j, d, \
7.3 UV-Cured Silicone Release Coatings
) j( `( r/ u1 k# o/ g7.4 Spot Curing/ ?% d" [% z* K' X# r2 Q, g3 u
7.5 UV Curing in Printing and Graphic Arts0 I* w& D" @# e8 w3 J
7.5.1 Screen Printing
7 r( Y/ G! t: W- f0 v9 Y! G) |1 o7.5.2 Flexography: P# z% F7 Q! }2 V4 k( W
7.5.3 Letterpress and Offset Letterpress (Dry Offset)& ?, q( F' b( P' p8 Z3 q
7.5.4 Lithography
" j5 L" ~4 p# \, l4 F6 L% H9 p7.5.5 Rotogravure Printing: F1 ?8 t6 v: F& x/ P" ~
7.6 Rapid Prototyping$ i! L+ F& I( L" g1 E9 ^
7.7 UV Powder Coatings
/ j& ?! C# C6 l8 h" U7.7.1 The Chemistry of UV-Curable Powders
; T$ e; }/ B* m- |" O4 w& h d7 `7.7.2 Material and Substrate Preparation
: u% X& Y8 X& w; c$ ~7.7.3 Powder Coating Application! C- _7 S: j% C* i6 ]% E
7.7.4 Substrates Suitable for UV Powder Coating! d ]/ E' u l) l8 K; ], E: h! w
7.7.4.1 Plastics& F" v _3 A2 }0 P/ |- A
7.7.4.2 Wood and Wood Composites3 w8 T1 ~9 D( R. X
7.7.4.3 Preassembled Parts
; f/ u I& d N+ D: Z- |% v1 R P7.7.4.4 Large-Mass Parts) `5 [; A( l" E) d
7.7.5 Applications
$ y& ?3 e) y3 W! u V4 S9 e. s+ i7.8 Other Applications for UV Curing
* F* @: Y$ X5 e+ K0 y7.8.1 Electronics
) ]' P' N! r5 G$ u7.8.2 Optical Components and Optoelectronic Applications/ K3 ^# H W) s0 Z+ Z; p7 M
7.8.2.1 Optical Fibers; k6 O7 |+ o0 [ w" X, d. n
7.8.2.2 Other Optical and Optoelectronic Applications8 t8 v- b7 ~8 u( ^* |& N
7.9 Production of Composites
) x. \6 l, y% ~- |0 L7.9.1 Dental Applications$ l$ ~$ t# g/ o# A! b
7.9.2 Other Composite Applications
* g$ e" \! N* W, n3 _Chapter 8 Applications of Electron Beam Radiation
: J* _5 P% u8 @9 d8.1 EB Processing in the Wire and Cable Technology
1 _) a$ o1 k( H/ S1 m8.1.1 Equipment and Process
: }3 d! w& M0 k3 R; m& m0 r( }8.1.2 Recent Developments and Trends
" R: L/ \7 G& ~* a/ ?0 q8.2 EB Processing in Tire Technology
' I: k U: o4 W; k# T$ N9 [3 v8.3 EB Processing in the Manufacture of Polyolefin Foams) A3 c3 |5 w0 c2 C7 f1 p
8.3.1 Foam Expansion and Its Control
O4 A6 v# W7 B8.3.2 Manufacturing Processes9 z1 I$ `* e* n. q
8.3.3 Comparison of Chemical and Radiation Processes5 H, d% D% f8 ~1 |- }
8.4 EB Processing in the Production of Heat-Shrinkable Materials; f% e5 ^% }& @. t+ U! B' H! v' l
8.4.1 Heat-Shrinkable Tubing+ \) i& v1 Q9 O/ y/ u4 I
8.4.2 Heat-Shrinkable Sheets and Films
1 ~' G; q/ E% y9 V" c4 x8.5 EB Processing in Coatings, Adhesives, Paints and Printing Inks
8 ]5 G. e+ W% ~ S' _9 s8.5.1 Magnetic Media. M I7 D# p3 n( S7 o3 n
8.5.2 Coatings) V. v, b. }3 a
8.5.3 Printing and Graphic Arts2 t, e8 W4 i9 ^! ~: b- p
8.5.4 Adhesives
' S% o5 v! U& T) M4 | h8.5.4.1 Pressure-Sensitive Adhesives (PSAs)" s8 K+ H1 Y6 ^5 p0 g& K
8.5.4.2 Laminating Adhesives
- u6 O/ F5 {( ]8.5.5 Polymeric Fiber-Reinforced Composites. p7 l Y5 P* l
References
9 V9 \8 e$ E& V5 _5 K! nChapter 9 Dosimetry and Radiometry
" Q. \+ f: q; h0 r6 V$ O3 g/ M h9.1 EB Dosimetry" g9 z' c! a$ _6 |5 t4 F& T
9.2 UV Radiometry
3 Y* a5 [3 W. G3 y) e5 v! c e9.2.1 Actinometers: X; B4 b2 `$ D8 |1 k- F
9.2.2 Radiometers- a& [; G! J5 ]" w4 b1 R6 H
9.2.3 Radiachromic Films! t2 k* g2 _$ A# f
References4 }6 f- f" w) e5 Y. P: w
Chapter 10 Safety and Hygiene
: D( n( e3 I2 t, \1 t, ?10.1 UV Equipment Health and Safety
: o8 s9 ~! A. M. M0 D9 g10.2 EB Equipment Health and Safety- Z: x+ i; h" F, U" N
10.3 Chemical Hazards
' \, z. J& J7 r1 a: P* N; i- YReferences
2 |2 s1 j3 F- Q: t0 b! M4 a% }' oChapter 11 Recent Developments and Trends
) S- N* u7 K3 F2 Z+ K11.1 Current Trends in Equipment and Chemistry/ K2 E* B+ g9 R6 e; h" p8 s$ i1 ]
11.1.1 UV/EB Equipment8 g* a: `( o, r, P
11.1.2 Chemistry0 K4 L2 H u5 J1 P! y0 f4 H
11.2 Emerging Technologies( S! s; q/ N6 t7 Z4 F/ `' G' G
References- I. ]& P8 w3 c2 O! f
Appendix I
" A- h' d: N/ Q+ Y5 cBibliography4 o) [$ q' M: l5 l
Appendix II
! ]! f+ j3 V; x8 |8 e2 l+ tMajor Equipment Manufacturers- j$ b8 y1 w0 _1 z6 }
Glossary0 D2 w. b% Z$ d* I% U% l9 A
$ `( e8 n% } y/ p. i2 x$ M6 M
[ 本帖最后由 benzone 于 2007-12-10 13:31 编辑 ] |
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