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HIGH-PERFORMANCE CONSTRUCTION MATERIALS:Science and Applications
7 B, Q; r- w7 L/ @( o* V; e" P9 H& K
Copyright © 2008 by World Scientific Publishing Co. Pte. Ltd.
2 { q! p! u3 p, A
+ _7 |' `3 F9 p" r. O+ V, FAll rights reserved. This book, or parts thereof, may not be reproduced in any form or by any means,) c/ `6 w/ @" \5 \9 t0 U
electronic or mechanical, including photocopying, recording or any information storage and retrieval7 ?) K5 A; ]8 X! Z7 G4 f
system now known or to be invented, without written permission from the Publisher.
8 n5 v3 E( I0 B8 e, ?& S/ O: E! S) q% l& z+ \+ f& y4 v
Author:D.D.L. Chung Book Series Editor Buffalo, NY, U.S.A.; ?% S5 `1 M/ C! Q _8 j( p$ \8 `
+ E& N5 x U; O6 f4 ^3 q7 X- fThis is the inaugural volume of the book series “Engineering Materials
: X8 {' q# C" [9 x& Dfor Technological Needs”. The technological needs relevant to this
6 G3 }/ p# @8 G/ dseries include those that are related to the electronic, optical, magnetic,
; M, e2 d5 I" Hthermal, electrochemical, energy, environmental, structural, construction,4 j# D$ [7 v- K; z) E
aerospace, automobile, security, manufacturing and medical industries.
9 x, r4 |( v+ b- a. t1 I" EEach book in the series addresses materials that serve various functions
9 ]2 S5 q, I6 m4 [in a particular area of technological need by describing the relevant9 z6 S8 T/ x7 i
scientific concepts, the status of the technological need, the limitations of/ X5 K5 B. B X/ k$ f; |
the technology, the pros and cons of the materials available, how the9 x e: |: J) n" J1 K p/ r
materials are applied, evaluated and fabricated, how various materials are
0 m0 F; h Z; P1 N7 j* Fintegrated to form an assembly that can be used in practice, the
# `/ l# w3 `( Wperformance and durability of the competing materials for each specific
6 n; Y% R" q# g5 g" h! t7 i+ ~application, and the future directions.
/ N z% }. o/ O+ r5 bThe books in this series differ from other books in their emphasis on) S* R, u/ Z& B7 U+ j2 q- m
materials for technological needs. Existing books in the materials area' E5 R" m- c7 D) P8 b0 q* W
largely focus on the fundamental science of particular classes of
9 B0 X. p& G/ [, A' \0 k! q# U2 qmaterials. The material classes in these existing books tend to be
* e. Y' Q3 `/ i0 a6 l( X4 o/ rdistinguished from the viewpoint of science rather than the viewpoint of
5 `0 n; p% Z, @) ~9 I6 @6 D$ I5 Yapplications. In contrast, from the viewpoint of a particular application,
! w( c: h' ~& g/ L7 k! e7 ^; bthe relevant materials may include metals, polymers, ceramics,
; g' x- X0 E* F' f6 X- e: ~composites and semiconductors, which constitute the traditional classes! s2 a- H) N% G: i9 f7 C- s
of materials. The impetus of scientific research hinges on the success of
, T7 Y! o) q, U8 |7 Dapplications. It is important to develop materials for applications rather
) ?9 L, V2 {1 C( r& E& _4 mthan just studying materials for the sake of advancing the science of
. M! x+ o; Q0 l( {4 F4 `2 Wmaterials. In spite of the obvious importance of the linkage between
9 }( n- @6 P) Y$ s6 O {* ^science and applications, this linkage has long been weak, due to
# F- N. C2 r. e- y! A: B! N$ Qinsufficient communication between the science community and the; N- z7 t/ K8 c) A
application community. This book series is intended to alleviate this
! @; h1 O {* U; eproblem by addressing materials from an application perspective. The4 n- N$ B! O" ?5 |) M
books do not assume prior knowledge of the applications and require from its readers the equivalence of only one introductory course in! Z; c ~, f9 J; b# x- M
materials science. Due to the tutorial nature of the books in the series,4 l' U$ F4 B5 [, c
the books are expected to be useful as textbooks in undergraduate and+ J8 g, Y# U! ?" }! a) n6 e9 f2 ]
graduate levels. In addition, due to the timeliness and importance of the
+ q$ Y7 c4 Y- ~" I, \topics and to the inclusion of an up-to-date list of references, these books' t9 k1 W) ]: L2 l
are expected to be used by professionals as reference books as well.
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! e+ v v& X% x+ s$ ]- e....../ T/ ~" Q4 J1 O# I- a; q
$ T0 R; u4 b3 u: r0 _7 I* h[ 本帖最后由 mwmwmw 于 2009-5-13 07:57 编辑 ] |
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