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HIGH-PERFORMANCE CONSTRUCTION MATERIALS:Science and Applications0 S& {% U& [- u+ n6 ^ g) M
6 O8 M4 `2 M i) Q! w+ wCopyright © 2008 by World Scientific Publishing Co. Pte. Ltd.$ n$ J/ a. O! x. c- k' ?# I
+ `/ w$ {; Q: {/ D4 Z
All rights reserved. This book, or parts thereof, may not be reproduced in any form or by any means,
! B: G! M$ s- P- U; i0 T" k( [electronic or mechanical, including photocopying, recording or any information storage and retrieval
- U, B/ L( d& vsystem now known or to be invented, without written permission from the Publisher.
% j' x5 X: x8 z+ r* I! L) S5 l* a$ X6 P8 W$ V% |' v5 T
Author:D.D.L. Chung Book Series Editor Buffalo, NY, U.S.A.
# h, u9 ~8 ^* P4 D, z
2 y2 [% C, C: v# q oThis is the inaugural volume of the book series “Engineering Materials
& r. V4 n. l2 L4 V" q& N8 _7 o, {- jfor Technological Needs”. The technological needs relevant to this
" ^2 `- a: R0 }: P7 d* ] xseries include those that are related to the electronic, optical, magnetic,# r6 u4 Q/ X( w J0 {
thermal, electrochemical, energy, environmental, structural, construction,
% |: S6 L/ A+ M& T( I# D/ }0 Raerospace, automobile, security, manufacturing and medical industries.
" w. e+ J% |1 Z" _$ v( wEach book in the series addresses materials that serve various functions+ P+ _, L# F- N/ B
in a particular area of technological need by describing the relevant) h/ c4 a c2 J- p7 f1 G
scientific concepts, the status of the technological need, the limitations of
& W4 n+ i0 }( M2 d# athe technology, the pros and cons of the materials available, how the3 B9 d, o1 X* a |) E% Q
materials are applied, evaluated and fabricated, how various materials are
/ C+ k; R1 C; I) L: F9 b8 Zintegrated to form an assembly that can be used in practice, the6 x. R% P/ c- H
performance and durability of the competing materials for each specific
, H& e) W" ^& c2 ~$ y- qapplication, and the future directions.
3 e9 x+ X1 ]- f# KThe books in this series differ from other books in their emphasis on
# @# J! V& |2 xmaterials for technological needs. Existing books in the materials area. L" N. U9 x K G
largely focus on the fundamental science of particular classes of
! c7 }1 s. |8 ^$ Bmaterials. The material classes in these existing books tend to be
) x8 G2 \- I# B8 e: U% {distinguished from the viewpoint of science rather than the viewpoint of& c& C0 d" H( X. o1 Y3 ?; v
applications. In contrast, from the viewpoint of a particular application,; r2 B+ }) o! P
the relevant materials may include metals, polymers, ceramics,
( g, M9 w+ \5 D' o" n( rcomposites and semiconductors, which constitute the traditional classes
4 W4 u/ g9 B$ g% j6 z% J. Q8 p! f- pof materials. The impetus of scientific research hinges on the success of
% h! R5 N# U, Yapplications. It is important to develop materials for applications rather" t& H5 a) N6 `- _0 @7 w
than just studying materials for the sake of advancing the science of( e" ^# _; x5 y7 |7 s
materials. In spite of the obvious importance of the linkage between# i& H! J* i: Z" Y4 {
science and applications, this linkage has long been weak, due to
* ]/ g2 h" R% B& z$ {3 F- cinsufficient communication between the science community and the
6 B4 G- ?4 K2 |* k) O+ happlication community. This book series is intended to alleviate this
$ r2 E% K: G [6 {* Gproblem by addressing materials from an application perspective. The
/ c7 I% H$ {/ \$ Cbooks do not assume prior knowledge of the applications and require from its readers the equivalence of only one introductory course in
1 Y4 b p6 c- S7 @* Z- A4 mmaterials science. Due to the tutorial nature of the books in the series, c# k. S0 |1 y$ S0 u
the books are expected to be useful as textbooks in undergraduate and
& ?* w4 v. Q5 Q: q# t# Jgraduate levels. In addition, due to the timeliness and importance of the
* o" O+ W2 q9 n* Q: i, i, gtopics and to the inclusion of an up-to-date list of references, these books
E! Y6 b; V8 p" |are expected to be used by professionals as reference books as well.: l* U: l% g4 @6 N
! M3 h" I1 u) K( a......
0 h( p% F! f4 F" x. _# Q3 [3 f Z! l
' z9 \) v/ j0 `7 \2 z[ 本帖最后由 mwmwmw 于 2009-5-13 07:57 编辑 ] |
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